XC6SLX25-N3FTG256C

The XC6SLX25-N3FTG256C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD designed for commercial embedded applications. It delivers a balanced combination of programmable logic, on-chip RAM and I/O to implement custom digital functions in a compact surface-mount package.

Key device metrics include 24,051 logic elements, approximately 0.96 Mbits of embedded memory (958,464 bits), and 186 I/O pins. The device is specified for a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C, packaged in a 256-LBGA / 256-FTBGA (17×17) footprint.

Key Features

• Programmable Logic Capacity 24,051 logic elements provide a substantial fabric for custom logic implementations and moderate-complexity designs.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM (958,464 bits) for buffers, FIFOs, and small data stores without external memory.
• I/O Resources 186 configurable I/O pins support a wide range of peripheral interfaces and board-level connectivity options.
• Power Supply Specified core supply voltage range of 1.14 V to 1.26 V for predictable power planning and regulator selection.
• Package and Mounting 256-LBGA (supplier package: 256-FTBGA, 17×17) surface-mount package enables a dense, compact PCB footprint.
• Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for a wide range of commercial applications.
• Environmental Compliance RoHS compliant to support designs that require restricted-substance conformance.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, protocol handling, and digital signal processing functions using the device's logic and on-chip RAM.
• Interface and Peripheral Bridging — Use the 186 I/O pins to connect and translate between multiple peripheral interfaces on constrained PCBs.
• Prototyping and Development — Leverage the Spartan-6 LX architecture to validate digital designs and iterate hardware-accelerated functions in commercial projects.
• Compact Electronics — The 256-LBGA surface-mount package supports compact board layouts where space and integration are priorities.

Unique Advantages

• High Logic Density: 24,051 logic elements enable implementation of sizeable custom logic blocks without external processing.
• On-chip RAM for Local Storage: Approximately 0.96 Mbits of embedded memory reduces reliance on external memory for mid-size buffering and state storage.
• Ample I/O Count: 186 I/O pins provide flexibility for multiple interfaces, sensors, and peripherals on a single device.
• Compact, Surface-Mount Package: 256-LBGA / 256-FTBGA (17×17) supports dense PCB designs and modern manufacturing processes.
• Tight Core Voltage Range: Defined 1.14 V–1.26 V supply window simplifies power sequencing and regulator selection for the core.
• Commercial Temperature and RoHS Compliance: Rated 0 °C–85 °C and RoHS compliant for standard commercial product deployments.

Why Choose XC6SLX25-N3FTG256C?

The XC6SLX25-N3FTG256C offers a practical balance of programmable logic, embedded memory and I/O in a compact 256-LBGA package, making it well suited to commercial embedded designs that require on-board customization and moderate resource density. As part of the Spartan®-6 LX family from AMD, it provides defined electrical and thermal parameters to aid predictable integration into production hardware.

Choose this device when your design requires a commercial-grade FPGA with substantial logic and memory resources, a high I/O count, and a small surface-mount footprint to optimize board area and integration.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX25-N3FTG256C.