XC6SLX25-N3CSG324I

The XC6SLX25-N3CSG324I is a Spartan®-6 LX field programmable gate array supplied in a 324-LFBGA/CSPBGA package. It combines a mid-range logic capacity with embedded memory and a large I/O count to address a range of industrial embedded processing, control and interface tasks.

Designed for surface-mount assembly and industrial operating conditions, this device targets designs that require significant programmable logic resources, substantial on-chip RAM, and a broad set of I/O in a compact 15×15 supplier package.

Key Features

• Logic Capacity — 24,051 logic elements enable complex combinational and sequential logic implementations and custom digital functions.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM for FIFOs, buffers, and microcontroller-like data storage within user logic.
• I/O Density — 226 user I/O pins to support multi-channel interfacing, parallel buses, and mixed-signal front-end connectivity.
• Power Supply — Core voltage operation from 1.14 V to 1.26 V to match system power design requirements.
• Package & Mounting — 324-LFBGA, CSPBGA package; supplier device package listed as 324-CSPBGA (15×15). Surface-mount mounting type for PCB integration.
• Temperature & Grade — Industrial-grade device with an operating temperature range of -40°C to 100°C for use in demanding environments.
• Regulatory — RoHS compliant to support lead-free manufacturing and environmental requirements.

Typical Applications

• Industrial Control — Implement motor control logic, sensor aggregation, and deterministic control tasks using the device’s programmable logic and I/O capacity.
• Interface Bridging — Act as protocol bridges or parallel-to-serial converters where numerous I/O and on-chip memory are needed for buffering and timing.
• Embedded Processing — Offload specialized processing functions and custom peripherals into programmable logic to reduce external components.

Unique Advantages

• Substantial Logic Resources: 24,051 logic elements provide the headroom for medium-complexity FPGA designs without immediate need to move to larger families.
• Ample On-Chip Memory: Approximately 0.96 Mbits of embedded RAM supports local buffering and state storage, simplifying board-level memory requirements.
• High I/O Count: 226 user I/O pins enable dense connectivity to sensors, interfaces and external devices, reducing the need for multiplexing.
• Industrial Operating Range: Specified for -40°C to 100°C operation, making it suitable for deployed systems in harsh or variable temperature environments.
• Compact Surface-Mount Package: The 324-CSPBGA (15×15) supplier package delivers a compact footprint for space-constrained PCBs while supporting automated assembly.
• RoHS Compliant: Aligns with lead-free manufacturing processes and environmental compliance goals.

Why Choose XC6SLX25-N3CSG324I?

The XC6SLX25-N3CSG324I offers a balanced combination of programmable logic, embedded memory and extensive I/O in a compact surface-mount package rated for industrial temperatures. It suits engineers looking to implement mid-range FPGA designs that require reliable operation across a broad temperature range and strong on-chip resources.

This device is appropriate for development teams and production designs that prioritize integration, flexible interfaces, and conformance to RoHS manufacturing requirements. Its specifications provide clear scaling potential within systems that benefit from programmable, reconfigurable logic.

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