XC6SLX25-L1CSG324I

The XC6SLX25-L1CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) in a 324-pin LFBGA (CSPBGA) package. Designed for industrial-temperature operation, it provides a balanced combination of programmable logic, embedded memory, and a high I/O count for systems requiring flexible digital logic implementation and robust interfacing.

Key Features

• Core Logic Contains 24,051 logic elements suitable for implementing custom digital functions and control logic.
• Embedded Memory Provides approximately 0.96 Mbits of on-chip RAM (958,464 total RAM bits) for data buffering, FIFOs, and local storage.
• I/O Capacity Offers 226 I/O pins to support multiple peripherals, buses, and external interfaces in a single device.
• Package & Mounting Supplied in a 324-LFBGA (324-CSPBGA, 15×15) package with surface-mount assembly for compact board layouts.
• Power Supply Operates from a core voltage supply range of 1.14 V to 1.26 V.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C, enabling use in industrial and other temperature-challenging environments.
• Regulatory Status RoHS compliant.

Typical Applications

• Industrial Control and Automation Implements custom control logic and sensor interfacing across a wide temperature range for factory and process equipment.
• Interface Bridging and Protocol Conversion Uses abundant I/O and programmable logic to bridge between diverse buses and peripheral standards on a single chip.
• Embedded System Prototyping Supports rapid hardware development and iteration for proof-of-concept and pre-production designs.
• Data Buffering and Custom Data Paths Leverages on-chip RAM and logic elements for temporary storage, packet handling, and tailored data flow architectures.

Unique Advantages

• Significant Logic Capacity: 24,051 logic elements enable implementation of complex, custom digital functions without immediate need for external logic.
• Substantial Embedded Memory: Approximately 0.96 Mbits of on-chip RAM reduces dependence on external memory for buffering and small data stores.
• High I/O Count: 226 I/O pins allow direct connection to multiple sensors, controllers, and interfaces, simplifying board-level design.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact BGA Package: 324-LFBGA (15×15 CSPBGA) enables a compact PCB footprint while maintaining extensive signal connectivity.
• RoHS Compliant: Meets lead-free and environmental requirements for modern manufacturing processes.

Why Choose XC6SLX25-L1CSG324I?

The XC6SLX25-L1CSG324I positions itself as a flexible, industrial-grade FPGA solution that combines a sizable logic element pool, nearly 1 Mbit of embedded memory, and a high I/O count in a compact 324-LFBGA package. These characteristics make it well suited for engineers designing industrial control systems, interface converters, prototyping platforms, and other embedded applications that require adaptable digital logic and reliable operation across a wide temperature range.

Choosing this device provides a balance of integration and environmental robustness—helpful for teams who need on-chip resources to reduce board-level complexity while maintaining a design that withstands industrial operating conditions.

Request a quote or submit your procurement inquiry to receive pricing and availability information for the XC6SLX25-L1CSG324I.