XC6SLX25-3FTG256I

The XC6SLX25-3FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) in a 256-LBGA package from AMD. It provides mid-range programmable logic resources, embedded memory and a high I/O count targeted at industrial and embedded designs that require flexible, reconfigurable logic.

With a specified operating range from -40 °C to 100 °C and an industrial grade designation, this device is suitable for applications that require a balance of logic capacity, on-chip memory and robust operating conditions.

Key Features

• Logic Capacity — 24,051 logic elements available for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM (958,464 total RAM bits) for buffering, FIFOs and small data storage tasks.
• I/O Resources — 186 user I/O pins to support multiple external interfaces and peripherals.
• Power Requirements — Core voltage supply range from 1.14 V to 1.26 V to match board-level power designs.
• Package & Mounting — 256-LBGA (supplier device package: 256-FTBGA, 17×17) optimized for surface-mount assembly.
• Operating Conditions — Industrial operating temperature from -40 °C to 100 °C for deployment in harsher environments.
• Environmental Compliance — RoHS compliant to meet regulatory material requirements.

Typical Applications

• Industrial Control — Implement motor control logic, PLC interfaces and deterministic I/O handling using the device's logic and I/O resources within industrial temperature ranges.
• Embedded Systems — Integrate custom processing pipelines, protocol bridging and peripheral aggregation in compact, surface-mount form factors.
• Communications Interfaces — Support interface conversion, parallel/serial bridging and protocol handling with plentiful I/O and on-chip memory for buffering.
• Sensor and Actuator Interfacing — Aggregate sensor inputs and implement deterministic actuator control leveraging the FPGA’s programmable logic and I/O density.

Unique Advantages

• Balanced Logic and Memory: Combining 24,051 logic elements with approximately 0.96 Mbits of embedded RAM enables a wide range of mid-density designs without external memory for many tasks.
• High I/O Count: 186 I/Os allow integration of multiple peripherals and interfaces directly to the FPGA, reducing the need for external glue logic.
• Industrial Temperature Rating: Specified operation from -40 °C to 100 °C supports deployment in demanding environments.
• Compact Surface-Mount Package: The 256-LBGA (256-FTBGA, 17×17) package delivers a small board footprint while accommodating substantial logic and I/O resources.
• Controlled Core Voltage: A defined core supply range (1.14 V to 1.26 V) simplifies power rail design and integration on multi-voltage boards.
• RoHS Compliant: Meets material compliance requirements for environmentally conscious designs.

Why Choose XC6SLX25-3FTG256I?

The XC6SLX25-3FTG256I positions itself as a mid-density, industrial-grade FPGA that balances programmable logic, embedded memory and a high I/O count in a compact 256-LBGA footprint. Its temperature range and surface-mount package make it suitable for embedded and industrial applications where board space and robust operation matter.

Designers seeking a reconfigurable solution with clear electrical and thermal specifications will find this device appropriate for prototyping and production use cases that require measurable logic capacity, on-chip RAM and substantial I/O connectivity.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX25-3FTG256I and to discuss how it can fit into your next design.