XC6SLX25-3FGG484I

The XC6SLX25-3FGG484I is an AMD Spartan®-6 LX field programmable gate array (FPGA) in a 484-pin BGA package designed for industrial-grade applications. It provides a balance of programmable logic capacity, embedded memory, and high I/O density for configurable digital designs.

This device features 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, and 266 general-purpose I/O, with a supply voltage range of 1.14–1.26 V and an operating temperature span of −40 °C to 100 °C, supporting surface-mount integration in a 484-ball BGA footprint.

Key Features

• Core Logic  24,051 logic elements to implement custom digital architectures and state machines.
• Embedded Memory  Approximately 0.96 Mbits (958,464 bits) of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O Density  266 I/O pins to support a broad set of external interfaces, sensors, and peripherals.
• Package & Mounting  484-BBGA package case with supplier package listed as 484-FBGA (23 × 23) and surface-mount mounting for compact board-level integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and design constraints.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and specified as industrial grade for use in demanding environments.
• Environmental Compliance  RoHS compliant for conformity with common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Use the device’s logic capacity and 266 I/O for programmable I/O, protocol translation, and control logic in automation equipment.
• Embedded Systems & Prototyping  Implement custom processing pipelines, glue logic, and rapid hardware prototyping leveraging the on-chip RAM and abundant logic elements.
• Communications & Interface Bridging  Deploy the I/O resources and programmable fabric for interface conversion, timing adaptation, and custom peripheral aggregation.

Unique Advantages

• Balanced Logic and Memory:  24,051 logic elements paired with approximately 0.96 Mbits of embedded RAM provide a versatile platform for mid-sized programmable designs.
• High I/O Count:  266 I/O pins simplify connectivity to multiple peripherals and external devices without extensive external logic.
• Industrial Reliability:  An operating temperature range of −40 °C to 100 °C supports deployment in industrial environments where extended thermal tolerance is required.
• Compact BGA Integration:  484-ball BGA footprint and surface-mount mounting enable dense PCB layouts while maintaining robust electrical connections.
• Regulatory Compatibility:  RoHS compliance aids integration into products targeting markets with environmental material restrictions.

Why Choose XC6SLX25-3FGG484I?

The XC6SLX25-3FGG484I delivers a practical combination of programmable logic, embedded memory, and high I/O count in a compact BGA package, positioned for industrial-grade applications where temperature tolerance and board-level density matter. Its specification set makes it suitable for engineers building mid-range FPGA-based systems that require flexible I/O and on-chip storage.

Designed and manufactured by AMD, this Spartan®-6 LX device is a choice for development teams and product designers seeking a scalable, reliable FPGA platform with clearly defined electrical and mechanical characteristics for integration into commercial and industrial products.

Request a quote or submit an RFQ to obtain pricing and availability for the XC6SLX25-3FGG484I.