XC6SLX25-3FG484I

The XC6SLX25-3FG484I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 484-BBGA package. It provides programmable logic capacity, embedded RAM, and a substantial number of I/O pins for integration into industrial designs.

Key device attributes include 24,051 logic elements, approximately 0.96 Mbits of on-chip RAM (958,464 bits), 266 I/O pins, industrial-grade operation, and a nominal core voltage range of 1.14 V to 1.26 V.

Key Features

• Logic Capacity  24,051 logic elements and 1,879 CLBs provide the programmable fabric for custom logic implementation and system control.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM (958,464 bits) supports local buffering, state storage, and data handling without external memory.
• I/O Density  266 I/O pins enable broad connectivity for peripherals, sensors, and external interfaces.
• Power Supply  Core voltage specified from 1.14 V to 1.26 V to match system power rails and design requirements.
• Package & Mounting  484-BBGA package case (supplier device package 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to support deployment in temperature-varied environments.
• Regulatory Compliance  RoHS compliant for environmental compliance in production and assembly.

Typical Applications

• Industrial Control  Custom logic, I/O aggregation and on-board processing within control systems operating across an industrial temperature range.
• Embedded Systems  Programmable functions and local memory for embedded designs that require flexible logic and multiple external interfaces.
• I/O-Intensive Designs  Applications that need significant I/O resources can leverage the device’s 266 I/O pins for sensor, actuator, and peripheral connectivity.

Unique Advantages

• Substantial Logic Resources: 24,051 logic elements and 1,879 CLBs give designers room to implement complex custom logic and control functions on a single device.
• On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for buffering and state storage.
• Wide I/O Capability: 266 I/O pins simplify interfacing to multiple peripherals and external devices without additional bridge components.
• Industrial-Grade Operation: Specified for −40 °C to 100 °C operation to support deployments in harsh or varying temperature environments.
• Compact Surface-Mount Package: 484-BBGA (484-FBGA, 23×23 supplier package) offers a high-density footprint suitable for space-constrained PCBs.
• RoHS Compliant: Meets environmental compliance requirements for manufacturing and assembly processes.

Why Choose XC6SLX25-3FG484I?

The XC6SLX25-3FG484I combines sizable programmable logic capacity, embedded RAM, and a high I/O count in a compact, industrial-grade package. Its voltage and temperature specifications make it appropriate for designs that require reliable operation across standard industrial conditions.

This device is a fit for engineering teams needing on-board programmable logic, local memory resources, and extensive I/O in a surface-mount 484-BBGA form factor, offering a balanced platform for scalable and robust system designs.

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