XC6SLX25-3CSG324C

IC FPGA 226 I/O 324CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 226 958464 24051 324-LFBGA, CSPBGA

Quantity 852 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O226Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits958464

Overview of XC6SLX25-3CSG324C – Spartan®-6 LX FPGA, 324-CSPBGA, 24,051 logic elements

The XC6SLX25-3CSG324C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD designed for commercial applications. It delivers configurable digital logic capacity in a compact 324-CSPBGA (15×15) surface-mount package, with a focus on embedded and consumer systems that require flexible, reprogrammable logic and I/O aggregation.

With a core supply of 1.14 V, approximately 0.96 Mbits of embedded memory and 226 user I/O, this device supports a range of custom digital functions while meeting common commercial temperature and mounting requirements.

Key Features

  • Logic Capacity — 24,051 logic elements provide substantial programmable logic resources for custom digital designs.
  • Embedded Memory — Approximately 0.96 Mbits of on-chip RAM for buffering, state storage and small data tables.
  • I/O Resources — 226 user I/O pins to support multiple interfaces and peripheral connections.
  • Package & Mounting — 324-CSPBGA (15×15) supplier device package in tray format, designed for surface-mount assembly.
  • Power — Single core supply specified at 1.14 V.
  • Operating Range — Commercial-grade operating temperature from 0 °C to 85 °C.

Typical Applications

  • Commercial Embedded Systems — Implement custom control logic, data handling and protocol bridging in space-constrained commercial devices.
  • Consumer Electronics — Enable configurable feature sets and interface aggregation for multimedia and connectivity products.
  • Prototyping & Custom IP — Use as a development platform for validating custom logic, accelerators and peripheral interfaces.

Unique Advantages

  • Substantial Logic Density: 24,051 logic elements enable complex combinational and sequential designs without external gate arrays.
  • On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces the need for external memory for many buffering and small-state applications.
  • High I/O Count: 226 user I/O lines simplify integration with multiple peripherals and interfaces, reducing board-level complexity.
  • Compact Package: 324-CSPBGA (15×15) provides a small footprint option for space-constrained PCBs while supporting surface-mount assembly.
  • Commercial Temperature Rating: 0 °C to 85 °C aligns with typical commercial deployment environments.

Why Choose XC6SLX25-3CSG324C?

The XC6SLX25-3CSG324C balances programmable logic capacity, on-chip memory and a high I/O count in a compact CSPBGA package targeted at commercial applications. It is well suited for designers needing reprogrammable logic resources and flexible interfacing in constrained form factors.

Its combination of 24,051 logic elements, approximately 0.96 Mbits of embedded RAM and 226 I/O pins delivers a scalable building block for embedded and consumer designs, supported by AMD’s Spartan®-6 device family ecosystem.

If you would like pricing, lead time or to request a quote for XC6SLX25-3CSG324C, submit an inquiry or request a quote and our team will respond with the details you need.

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