XC6SLX25-2FTG256C

The XC6SLX25-2FTG256C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD provided in a 256-LBGA package. It combines a reconfigurable logic fabric with embedded memory and a substantial I/O complement for a wide range of FPGA applications.

Key on-chip capacities include approximately 24,051 logic elements and approximately 0.96 Mbits of embedded memory (958,464 bits), with 186 available I/O pins. The device is supplied as a surface-mount 256-FTBGA (17×17) package, operates from a core supply of 1.14 V to 1.26 V, and is specified for commercial temperatures (0 °C to 85 °C). The part is RoHS compliant.

Key Features

• Logic Capacity  Approximately 24,051 logic elements providing the programmable fabric for custom digital designs.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM (958,464 bits) available for FIFOs, buffering, and local storage.
• I/O  186 I/O pins to support a variety of external interfaces and board-level connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Package & Mounting  256-LBGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor for compact board integration.
• Operating Conditions & Compliance  Commercial-grade device rated for 0 °C to 85 °C and RoHS compliant.

Typical Applications

• Reconfigurable Logic Systems  Implement custom digital functions and protocol logic using the device's programmable fabric and embedded memory.
• Prototyping and Development  Use the FPGA for hardware prototyping and iterative design validation where reprogrammability accelerates development cycles.
• Embedded System Integration  Provide glue logic, interface adaptation, and I/O expansion between digital subsystems on compact boards.

Unique Advantages

• Substantial logic density: Approximately 24,051 logic elements allow implementation of complex logic functions within a single device.
• Embedded memory resources: Approximately 0.96 Mbits of on-chip RAM reduce dependency on external memory for local storage and buffering.
• Generous I/O count: 186 I/O pins support multiple external interfaces and system-level connectivity.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) provides a small footprint for board-level designs.
• Defined operating and supply ranges: Commercial temperature rating (0 °C to 85 °C) and a specified core supply of 1.14 V–1.26 V enable straightforward power and thermal planning.
• Regulatory compliance: RoHS compliant to support lead-free assembly requirements.

Why Choose XC6SLX25-2FTG256C?

The XC6SLX25-2FTG256C delivers a balanced combination of logic capacity, on-chip memory, and I/O in a compact 256-LBGA surface-mount package from AMD. Its specification set—including approximately 24,051 logic elements, about 0.96 Mbits of embedded RAM, 186 I/Os, a 1.14 V–1.26 V core supply range, and commercial temperature rating—makes it a practical choice for designers who need reconfigurable logic with clear, verifiable device parameters.

This part is well suited to engineering teams and procurement organizations building FPGA-based prototypes, embedded interfaces, and reconfigurable digital subsystems that require documented capacities and standard commercial-grade operating conditions.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX25-2FTG256C. Our team can provide lead-time and ordering details to support your design timeline.