XC6SLX25-2FGG484C

The XC6SLX25-2FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC manufactured by AMD. It provides a mid-range logic capacity and on-chip memory in a compact 484-ball BGA package for commercial-grade electronic designs.

Designed for applications that require configurable logic, substantial I/O count, and embedded RAM, this device targets commercial systems with typical operating conditions between 0 °C and 85 °C.

Key Features

• Core & Architecture  Field programmable FPGA implementation suitable for custom logic and hardware acceleration tasks, offered in the Spartan®-6 LX family.
• Logic Capacity  24051 logic elements providing substantial combinational and sequential logic resources for mid-density designs.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM (958,464 bits) for buffering, storage, and local data processing.
• I/O  266 user I/O pins to support a wide range of external interfaces and parallel/serial connections.
• Power  Core voltage supply range from 1.14 V to 1.26 V, enabling precise power planning for the FPGA core.
• Package & Mounting  484-ball BGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Operating Range & Grade  Commercial-grade operation with specified ambient temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, meeting common requirements for lead-free manufacturing.

Typical Applications

• Programmable logic and prototyping  Use as a configurable hardware platform where up to 24051 logic elements enable board-level prototyping and custom logic development.
• I/O-intensive interfacing  Leverage 266 I/O pins for bridging multiple peripherals, sensors, or buses in commercial electronic systems.
• On-chip buffering and data staging  Utilize approximately 0.96 Mbits of embedded memory for temporary data storage, buffering, and small-scale packet or frame handling.
• Hardware acceleration  Deploy the device where additional programmable logic is needed to offload specific functions from a host processor within commercial operating conditions.

Unique Advantages

• Substantial logic density: 24051 logic elements provide designers with ample resources for mid-range FPGA implementations without moving to larger families.
• High I/O count: 266 user I/O pins support complex external connectivity and multi-channel interfacing on a single device.
• Meaningful embedded memory: Nearly 1 Mbit of on-chip RAM reduces reliance on external memory for many buffering and state-storage needs.
• Compact BGA footprint: 484-ball FBGA (23×23) enables a high-density package suitable for space-constrained commercial PCBs.
• Commercial temperature range: Rated for 0 °C to 85 °C operation to match typical commercial electronic product requirements.
• RoHS compliant: Supports lead-free manufacturing processes and regulatory requirements for many commercial markets.

Why Choose XC6SLX25-2FGG484C?

The XC6SLX25-2FGG484C offers a balanced mix of logic capacity, embedded memory, and I/O resources in a compact surface-mount BGA package from AMD, tailored for commercial-grade applications. Its specification set makes it suitable for designers who need configurable hardware resources and meaningful on-chip RAM while maintaining a compact board footprint.

This device is well suited to teams building mid-density FPGA designs that require predictable operating temperature limits and RoHS compliance, offering a straightforward option for commercial electronic systems where programmable logic and substantial I/O are required.

Request a quote or submit a product inquiry today to get pricing and availability for the XC6SLX25-2FGG484C.