XC6SLX25-2FG484I

The XC6SLX25-2FG484I is an AMD Spartan‑6 LX field programmable gate array supplied in a 484‑ball BGA package. It provides a balance of programmable logic, embedded memory and I/O density for industrial designs.

With 24,051 logic elements and approximately 0.96 Mbits of on‑chip RAM, this surface‑mount FPGA targets applications that require configurable digital logic, substantial embedded memory and a wide operating temperature range.

Key Features

• Core Logic — 24,051 logic elements to implement custom digital functions and state machines.
• Configurable Logic Blocks (CLBs) — 1,879 CLBs for structured logic partitioning and design scalability.
• Embedded Memory — Approximately 0.96 Mbits (958,464 bits) of on‑chip RAM for buffers, FIFOs and small data stores.
• I/O Density — 266 general‑purpose I/O pins to support a variety of external interfaces and parallel buses.
• Power Supply — Core voltage range of 1.14 V to 1.26 V to match system power rails.
• Industrial Grade — Rated for an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Package & Mounting — 484‑BBGA package (supplier device package: 484‑FBGA, 23×23) with surface‑mount mounting suitable for compact PCBs.
• Environmental Compliance — RoHS‑compliant construction.

Typical Applications

• Industrial Control Systems — Use the industrial temperature rating and substantial I/O to implement control logic, custom interfaces and deterministic I/O handling.
• Embedded Logic and Glue — Deploy the 24,051 logic elements and on‑chip RAM to integrate glue logic, protocol converters and timing-critical data paths.
• High‑I/O Interfaces — Leverage 266 I/O pins for parallel sensor arrays, data acquisition front ends or interface bridging.

Unique Advantages

• Balanced Logic and Memory: 24,051 logic elements paired with approximately 0.96 Mbits of RAM enable medium‑complexity designs without external SRAM for many use cases.
• High I/O Count: 266 I/O pins simplify board‑level integration with multiple peripherals and buses, reducing the need for external multiplexers.
• Industrial Reliability: Qualified for −40 °C to 100 °C operation, supporting deployment in temperature‑sensitive industrial environments.
• Compact Packaging: 484‑BBGA (23×23) surface‑mount package provides high pin density in a compact footprint for space‑constrained PCBs.
• Standards‑Aware Supply: RoHS compliance supports regulatory and sustainability requirements.

Why Choose XC6SLX25-2FG484I?

The XC6SLX25-2FG484I positions itself as a practical FPGA choice for industrial applications that need a mid‑range combination of logic capacity, embedded memory and broad I/O. Its industrial temperature rating and compact 484‑BBGA package make it suitable for embedded systems where robustness and board density matter.

This part is a fit for engineers building customizable digital subsystems, consolidating glue logic, or integrating multiple interfaces on a single programmable device while maintaining compliance with RoHS requirements.

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