XC6SLX16-N3FT256I

The XC6SLX16-N3FT256I is an AMD Spartan®-6 LX field programmable gate array (FPGA) supplied in a 256-LBGA package. It delivers a balance of logic capacity, embedded memory, and I/O density intended for industrial-class applications where programmable logic and system integration are required. Key attributes include a mid-range logic element count, on-chip RAM, a 186-pin I/O complement, and industrial operating temperature support.

Key Features

• Core Logic — 14,579 logic elements and 1,139 CLBs provide the programmable fabric for implementing custom digital functions.
• Embedded Memory — Approximately 0.59 Mbits (589,824 bits) of on-chip RAM for buffering, queuing, and small data stores.
• I/O — 186 I/O pins to interface with peripherals, sensors, and external devices.
• Power — Core voltage supply range from 1.14 V to 1.26 V to match system power design requirements.
• Package & Mounting — 256-LBGA package (supplier device package: 256-FTBGA, 17×17) designed for surface-mount assembly.
• Environmental & Reliability — Industrial-grade device with an operating temperature range of −40 °C to 100 °C and RoHS compliance.

Typical Applications

• Industrial Control — Programmable logic and I/O density make the device suitable for motion control, PLC functions, and factory automation interfaces within industrial temperature ranges.
• Embedded Systems — Implement glue logic, custom peripherals, or system controllers that benefit from on-chip RAM and flexible I/O.
• Communications & Networking — Use the FPGA’s logic and I/O count for protocol handling, buffering, and interface bridging in communication equipment.

Unique Advantages

• Balanced Logic Capacity: 14,579 logic elements and 1,139 CLBs provide sufficient resources for mid-range programmable designs without excessive area.
• On-Chip RAM: Approximately 0.59 Mbits of embedded memory reduces reliance on external RAM for small buffers and state storage.
• Generous I/O Count: 186 I/O pins allow direct connection to a wide range of peripherals and interfaces, simplifying board-level design.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to meet many industrial deployment conditions.
• Compact, Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) supports high-density PCB layouts and automated assembly processes.
• Low-Voltage Core: Core supply between 1.14 V and 1.26 V supports modern power-rail designs.
• RoHS Compliant: Conforms to RoHS environmental requirements for lead-free assembly.

Why Choose XC6SLX16-N3FT256I?

The XC6SLX16-N3FT256I positions itself as a practical FPGA choice for engineers needing a balance of programmable logic, embedded memory, and I/O in an industrial-grade device. Its specification set—covering logic capacity, on-chip RAM, 186 I/O pins, and a compact 256-LBGA package—supports a wide range of mid-range designs that require deterministic behavior across a broad temperature range.

This Spartan®-6 LX device is suited to teams and projects that prioritize integration, maintainability, and predictable supply-chain components from an established FPGA manufacturer. It offers scalability for designs that may evolve over time while providing verifiable electrical and environmental characteristics for industrial deployments.

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