XC6SLX16-N3CSG225C

The XC6SLX16-N3CSG225C is a Spartan®-6 LX field programmable gate array (FPGA) IC that provides on-chip programmable logic and embedded memory for digital system design. It combines 14,579 logic elements with approximately 0.59 Mbits of embedded RAM to support a range of configurable digital functions.

This commercial-grade, surface-mount FPGA is supplied in a 225-pin CSPBGA package and operates from a 1.14 V to 1.26 V core supply within a 0 °C to 85 °C operating range, offering a compact, RoHS-compliant option for designs requiring reconfigurable logic and moderate I/O counts.

Key Features

• Logic Capacity  Provides 14,579 logic elements to implement custom digital functions and control logic within a single device.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, small data storage, and local state machines.
• I/O Count  160 user I/O pins to connect to peripherals, sensors, or external logic devices.
• Package  225-LFBGA / 225-CSPBGA (13×13) compact BGA package suitable for high-density PCB designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power rails and enable predictable power delivery.
• Thermal and Grade  Commercial operating temperature range of 0 °C to 85 °C and commercial-grade qualification for general-purpose applications.
• Mounting and Compliance  Surface-mount device with RoHS compliance for lead-free assembly processes.

Typical Applications

• Reconfigurable Digital Logic  Use as a programmable fabric to implement custom state machines, data processing pipelines, or glue logic between system components.
• I/O Bridging and Interface Control  Leverage 160 I/Os to adapt, buffer, or translate signals between different on-board subsystems and peripherals.
• Embedded Memory Tasks  Employ the on-chip RAM for lightweight buffering, FIFOs, and small lookup tables within timing-critical paths.

Unique Advantages

• Significant Logic Density:  14,579 logic elements enable consolidation of multiple functions into a single programmable device, reducing bill-of-materials and board complexity.
• Compact BGA Footprint:  225-CSPBGA (13×13) package allows a small PCB area while maintaining substantial I/O and logic resources.
• Predictable Power Envelope:  Defined core voltage range (1.14 V–1.26 V) supports stable power design and predictable integration into existing power architectures.
• Commercial Temperature Range:  Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant:  Meets lead-free assembly requirements for environmentally conscious manufacturing.

Why Choose XC6SLX16-N3CSG225C?

The XC6SLX16-N3CSG225C positions itself as a compact, commercial-grade FPGA offering a balance of logic capacity, on-chip memory, and moderate I/O in a small BGA package. Its specification set supports designers seeking to integrate configurable digital logic and modest embedded memory without increasing board area.

This device is well suited to teams and projects that need a reprogrammable platform with clear electrical and thermal parameters, RoHS compliance, and a compact package footprint, providing long-term flexibility through a programmable hardware resource.

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