XC6SLX16-L1CSG324I

The XC6SLX16-L1CSG324I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD supplied in a 324-pin LFBGA (324-CSPBGA 15×15) surface-mount package. It provides a mid-range combination of logic capacity, on-chip memory, and I/O density for embedded and industrial designs.

With 14,579 logic elements, approximately 0.59 Mbits of embedded RAM, 232 I/O pins, and an industrial operating temperature range, this device targets applications that require programmable logic, I/O flexibility, and operation across extended temperatures.

Key Features

• Core Logic  14,579 logic elements provide programmable fabric for custom logic, state machines, and glue-logic integration.
• Configurable Logic Blocks  1,139 CLBs for structured implementation of combinational and sequential logic resources.
• On-Chip Memory  Approximately 0.59 Mbits of total embedded RAM for buffering, FIFOs, and on-chip data storage.
• I/O Density  232 user I/O pins to support multiple parallel interfaces and high I/O-count designs.
• Power  Core voltage supply range of 1.14 V to 1.26 V for integration with low-voltage power domains.
• Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) surface-mount package suitable for compact PCB implementations.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C to support extended-environment deployments.
• Environmental Compliance  RoHS compliant construction.

Typical Applications

• Industrial Control  Programmable logic for control, sequencing, and interface tasks in equipment operating across an extended temperature range.
• I/O Expansion & Interface Bridging  High I/O count supports protocol bridging, parallel interface aggregation, and glue logic between system peripherals.
• Embedded System Integration  On-chip RAM and ample logic elements enable buffering, state machines, and custom datapath implementations in embedded designs.
• Prototyping & Proof-of-Concept  Reprogrammable fabric for developing and validating custom digital logic before final ASIC or system integration.

Unique Advantages

• Balanced Logic and Memory: 14,579 logic elements combined with approximately 0.59 Mbits of embedded RAM provide the resources to implement a wide range of custom logic and buffering functions on a single device.
• High I/O Count: 232 I/O pins allow integration with multiple peripherals and parallel interfaces without external I/O expanders.
• Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet the demands of extended-temperature industrial applications.
• Compact Surface-Mount Package: 324-CSPBGA (15×15) package enables dense PCB layouts and space-constrained board designs.
• Low-Voltage Core: Core supply range of 1.14 V to 1.26 V supports low-voltage system architectures.
• RoHS Compliant: Environmentally compliant construction for designs requiring restricted-substance adherence.

Why Choose XC6SLX16-L1CSG324I?

The XC6SLX16-L1CSG324I positions itself as a versatile, industrial-grade FPGA that combines a practical balance of logic capacity, embedded memory, and abundant I/O in a compact 324-LFBGA package. It is well suited for engineers designing embedded systems, industrial controllers, or I/O-intensive applications that require programmable logic and operation across extended temperatures.

Choosing this device provides a programmable platform that simplifies design integration—reducing external components by consolidating custom logic, buffering, and interface functions on-chip—while meeting environmental compliance and industrial operating requirements.

Request a quote or contact sales to check availability and pricing for the XC6SLX16-L1CSG324I.