XC6SLX16-L1FTG256I

The XC6SLX16-L1FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 256-LBGA package for surface-mount assembly. It offers a balance of on-chip logic, embedded memory and I/O density suitable for industrial applications that require reconfigurable logic and system integration.

With 14,579 logic elements, approximately 0.59 Mbits of embedded memory and 186 I/O pins, this device supports designs that need moderate programmable logic capacity, embedded RAM and a substantial I/O count within a compact BGA footprint.

Key Features

• Core Logic  Approximately 14,579 logic elements provide configurable resources for implementing custom digital logic, control paths and processing pipelines.
• Embedded Memory  Total on-chip RAM of 589,824 bits (approximately 0.59 Mbits) for buffering, state storage and local data handling.
• I/O Density  186 user I/O pins support interfacing to peripherals, sensors, buses and external logic devices.
• Voltage Supply  Core supply range from 1.14 V to 1.26 V to match system power rails and design requirements.
• Package & Mounting  256-LBGA package (supplier package: 256-FTBGA, 17×17) designed for surface-mount PCB assembly to save board area.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for a wide range of industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use the programmable logic and I/O density for machine control, PLC functions and sensor interfacing in industrial equipment.
• Communications Interfaces  Implement protocol bridging, data aggregation and custom interface logic leveraging on-chip memory and abundant I/O.
• Instrumentation & Test  Deploy as configurable front-end logic for test equipment where reprogrammable logic and deterministic I/O are required.

Unique Advantages

• Balanced Integration:  Combines 14,579 logic elements with embedded RAM and 186 I/Os for compact implementations that reduce external components.
• Industrial Qualification:  Rated for −40 °C to 100 °C operation, enabling deployment in temperature-demanding industrial environments.
• Compact BGA Package:  256-LBGA (256-FTBGA, 17×17) enables high-density PCB layouts while keeping a broad I/O count.
• Precise Power Envelope:  Defined core voltage range (1.14 V to 1.26 V) simplifies power-supply planning and design integration.
• RoHS Compliant:  Meets RoHS requirements for lead-free assembly and regulatory compliance.

Why Choose XC6SLX16-L1FTG256I?

The XC6SLX16-L1FTG256I sits at the intersection of moderate logic capacity, useful embedded memory and substantial I/O in a compact industrial-grade package. It is well suited for designers who need reconfigurable logic and dependable operation across a wide temperature range without sacrificing PCB real estate.

This part is a practical choice for engineering teams developing industrial control systems, communication interfaces and test instrumentation that benefit from in-field reprogrammability, a defined power envelope and a high I/O count.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX16-L1FTG256I and to discuss how it fits your design requirements.