XC6SLX16-L1FT256I

The XC6SLX16-L1FT256I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD offered in a 256-ball BGA package. It provides reconfigurable logic resources and on-chip memory for mid-density logic designs targeted at industrial applications.

Designed for surface-mount assembly and industrial operation, the device combines 14,579 logic elements, approximately 0.59 Mbits of embedded memory, and 186 general-purpose I/O pins, while operating from a 1.14 V to 1.26 V supply across a −40 °C to 100 °C temperature range.

Key Features

• Core Logic  Approximately 14,579 logic elements suitable for mid-density custom logic implementations and control functions.
• Embedded Memory  Approximately 0.59 Mbits of on-chip RAM for buffering, state storage, and small-data structures without external memory.
• I/O Capacity  186 device I/O pins provide flexible interfacing to sensors, peripherals, and external logic.
• Power  Specified operating supply range of 1.14 V to 1.26 V for core power sequencing and supply design considerations.
• Package  256-LBGA package (supplier device package: 256-FTBGA, 17×17) for compact board integration and high pin density.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, supporting deployment in temperature-challenging environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern assembly processes and environmental regulations.

Typical Applications

• Industrial Control  Custom logic, sensor interfacing, and control algorithms benefiting from industrial temperature ratings and flexible I/O.
• Embedded Systems  Mid-density processing and glue-logic tasks where integrated RAM and programmable logic reduce external component count.
• Communications Interfaces  Protocol bridging and interface adaptation using abundant I/O and reconfigurable logic to support varied signal requirements.
• Prototyping & Custom Hardware  Hardware validation and iterative design where reconfigurable logic accelerates development cycles and hardware testing.

Unique Advantages

• Substantial Logic Capacity: Approximately 14,579 logic elements enable implementation of complex control and data-path functions without moving to larger devices.
• On-Chip Memory: Roughly 0.59 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary data storage.
• High I/O Count: 186 I/O pins provide broad connectivity options for multichannel interfaces and mixed-signal front ends.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a surface-mount BGA package suitable for industrial deployments.
• Compact Package: 256-ball BGA (256-FTBGA, 17×17) offers a space-efficient footprint for dense board designs.
• Regulatory Compliance: RoHS-compliant construction supports environmental and manufacturing requirements.

Why Choose XC6SLX16-L1FT256I?

The XC6SLX16-L1FT256I delivers a balanced combination of logic density, embedded memory, and I/O capability in a compact industrial-grade package. Its supply voltage specification and operating temperature range make it suitable for designs that require reliable, reconfigurable logic in production environments.

This device is well suited to engineers and procurement teams building mid-density FPGA solutions for industrial control, embedded systems, and interface adaptation where board space, on-chip resources, and industrial temperature performance are key considerations.

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