XC6SLX16-N3CPG196I

The XC6SLX16-N3CPG196I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers a balanced combination of logic capacity, embedded memory, and I/O capability in a compact 196‑TFBGA (CSBGA) surface-mount package.

This device is specified for industrial applications with an operating temperature range of −40 °C to 100 °C and a nominal supply window of 1.14 V to 1.26 V, making it suitable for designs that require deterministic logic resources, on-chip RAM, and up to 106 I/Os.

Key Features

• Logic Capacity — 14,579 logic elements and 1,139 configurable logic blocks (CLBs) provide a substantive fabric for custom digital functions and glue logic.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for buffering, state storage, and small local data structures.
• I/O Resources — 106 user I/O pins to interface with peripherals, sensors, and external devices.
• Power — Specified core voltage supply range from 1.14 V to 1.26 V to match system power rails and design constraints.
• Package & Mounting — 196‑TFBGA (CSBGA) supplier device package 196‑CSPBGA (8×8) in a surface-mount form factor for compact board integration.
• Temperature & Grade — Industrial-grade device rated for −40 °C to 100 °C operation.
• Compliance — RoHS‑compliant for environmental and manufacturing compatibility.

Typical Applications

• Industrial Control — Use the device where industrial temperature rating and available logic/I/O resources support control algorithms, sensor interfacing, and deterministic sequencing.
• Embedded System Glue Logic — Implement custom bus bridges, protocol converters, and peripheral aggregation using the available logic elements and I/Os.
• Communication Interfaces — Deploy for interface adaptation and signal conditioning tasks that require flexible I/O mapping and on-chip memory buffering.

Unique Advantages

• Flexible Logic Resources: 14,579 logic elements enable implementation of substantial custom logic and state machines without external ASICs.
• On‑Chip Memory: Approximately 0.59 Mbits of embedded RAM reduces dependence on external memory for small buffers and local storage.
• Generous I/O Count: 106 I/Os allow direct connection to a wide range of peripherals and sensors, minimizing extra interface components.
• Industrial Temperature Rating: Qualified for −40 °C to 100 °C operation to meet harsher environment requirements.
• Compact Surface‑Mount Package: 196‑TFBGA (8×8 CSPBGA) supports space-constrained board layouts and automated assembly processes.
• Regulatory Compatibility: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC6SLX16-N3CPG196I?

The XC6SLX16-N3CPG196I positions itself as a practical FPGA choice for designers who need a balance of logic capacity, embedded memory, and a substantial I/O complement in an industrial-grade package. Its specification set—14,579 logic elements, approximately 0.59 Mbits of on-chip RAM, 106 I/Os, and a −40 °C to 100 °C operating range—aligns with projects that require reliable, reconfigurable logic in challenging environments.

Suited for embedded engineers and procurement teams building control systems, interface logic, or communication adapters, this Spartan®-6 LX device provides predictable resources and a compact footprint that help simplify board-level integration and long-term deployment.

Request a quote or submit a procurement inquiry for XC6SLX16-N3CPG196I to receive pricing and availability information tailored to your project requirements.