XC6SLX25-2CSG324C

The XC6SLX25-2CSG324C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 324-pin LFBGA/CSPBGA package. It delivers a balanced set of programmable logic resources, embedded memory, and I/O for commercial electronic designs.

With 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, and up to 226 I/O, the device is positioned for commercial-grade applications where on-chip logic, memory and I/O density are primary considerations.

Key Features

• Core Logic – Provides 24,051 logic elements to implement custom digital functions and state machines.
• Embedded Memory – Approximately 0.96 Mbits (958,464 bits) of on-chip RAM to support buffering, FIFOs, and small data storage needs.
• I/O Capacity – Up to 226 user I/O pins for interfacing with peripherals, sensors, and external logic.
• Power Supply – Core voltage range from 1.14 V to 1.26 V to match system power domains and core requirements.
• Package & Mounting – 324-LFBGA (324-CSPBGA, 15 × 15) surface-mount package suitable for compact board layouts.
• Commercial Grade Temperature – Rated for 0 °C to 85 °C operation for mainstream commercial environments.
• Environmental Compliance – RoHS compliant for regulatory and assembly considerations.

Typical Applications

• Embedded systems – Implement custom logic and control functions using the device’s 24,051 logic elements and on-chip RAM.
• I/O bridging and protocol conversion – Use up to 226 I/O pins to connect multiple peripherals or translate between interfaces.
• Data buffering and small memory functions – Leverage approximately 0.96 Mbits of embedded RAM for temporary storage, FIFOs, and buffering tasks.

Unique Advantages

• Substantial logic capacity: 24,051 logic elements provide room for moderate-complexity custom logic implementations without external gate arrays.
• Integrated memory: Approximately 0.96 Mbits of embedded RAM reduces the need for external memory in buffering and data-path applications.
• High I/O count: Up to 226 I/O pins support broad connectivity to peripherals, sensors, and external devices.
• Compact, surface-mount package: The 324-CSPBGA (15 × 15) package supports dense board designs while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and assembly processes.

Why Choose XC6SLX25-2CSG324C?

The XC6SLX25-2CSG324C offers a practical combination of logic density, embedded memory and I/O in a compact 324-LFBGA surface-mount package, targeted at commercial electronic designs. Its resource mix—24,051 logic elements, approximately 0.96 Mbits of on-chip RAM and up to 226 I/O—makes it suitable for projects that require on-chip processing, buffering and broad peripheral connectivity within standard commercial temperature ranges.

As a Spartan®-6 LX family device from AMD, this FPGA provides a defined resource set for designers who need a commercially rated, RoHS-compliant programmable logic solution with a clear voltage and temperature specification for system integration.

Request a quote or submit a purchase inquiry for the XC6SLX25-2CSG324C to evaluate its fit for your next commercial FPGA design.