XC6SLX25-2CSG324I

The XC6SLX25-2CSG324I is a Spartan®-6 LX field programmable gate array in a 324-pin LFBGA (CSPBGA) package designed for industrial-grade applications. It provides configurable logic resources, on-chip memory, and a high I/O count to support embedded designs that require programmable logic and robust operating range.

With 24,051 logic elements, approximately 0.96 Mbits of embedded memory, and up to 226 I/O, this device targets designs that need moderate logic density, significant local RAM, and flexible interfacing while operating across an industrial temperature range.

Key Features

• Logic Density  24,051 logic elements suitable for mid-range programmable-logic implementations.
• Embedded Memory  Approximately 0.96 Mbits (958,464 bits) of on-chip RAM for local data buffering and state storage.
• I/O Capacity  Up to 226 user I/O pins to support multiple parallel interfaces and signal routing requirements.
• Industrial Temperature Range  Rated to operate from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Power Supply Range  Core voltage supply specified from 1.14 V to 1.26 V to match system power designs.
• Package and Mounting  324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact PCB footprint and reliable soldered attachment.
• Regulatory Compliance  RoHS-compliant construction to meet environmental and manufacturing requirements.

Typical Applications

• Industrial control and automation  Use the device where industrial-temperature operation and mid-range programmable logic are required for control logic and interfacing.
• Embedded processing and glue logic  Implement custom data paths, protocol bridging, or peripheral aggregation using the available logic elements and on-chip RAM.
• I/O-intensive systems  Leverage the 226 I/O pins to connect multiple sensors, actuators, or external devices requiring parallel or mixed-signal interfacing.

Unique Advantages

• Industrial-grade operation: Specified −40 °C to 100 °C operation supports deployment in thermally challenging environments.
• Balanced logic and memory: 24,051 logic elements paired with approximately 0.96 Mbits of embedded RAM enables a range of mid-density designs without external SRAM for many use cases.
• High pin-count flexibility: 226 I/O pins provide ample connectivity for multi-interface designs and complex routing needs.
• Compact, solder-mounted package: The 324-LFBGA (15×15) CSPBGA package offers a small PCB footprint while supporting surface-mount manufacturing processes.
• Controlled core voltage: A defined supply range (1.14 V to 1.26 V) simplifies power-system planning for consistent device operation.
• RoHS compliance: Environmentally compliant materials reduce regulatory and manufacturing complexity.

Why Choose XC6SLX25-2CSG324I?

The XC6SLX25-2CSG324I positions itself as a solid option for designs that require a mid-range FPGA with substantial logic resources, embedded RAM, and a high I/O count, all within an industrial-temperature rated package. Its combination of 24,051 logic elements, approximately 0.96 Mbits of on-chip memory, and 226 I/O pins makes it suitable for embedded systems where local processing, interface consolidation, and reliable operation across −40 °C to 100 °C are important.

For engineering teams and procurement focused on scalable, reliable programmable logic solutions, this Spartan®-6 LX device provides clear hardware specifications to align system performance, board layout, and power design decisions while maintaining RoHS compliance.

Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC6SLX25-2CSG324I.