XC6SLX25-2FG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA |
|---|---|
| Quantity | 407 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 266 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1879 | Number of Logic Elements/Cells | 24051 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC6SLX25-2FG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA
The XC6SLX25-2FG484C is an AMD Spartan®-6 LX field programmable gate array supplied in a 484-BBGA package. This commercial-grade FPGA integrates a substantial logic capacity together with on-chip memory and a large number of I/O pins to address a wide range of programmable digital designs.
Key characteristics include 24,051 logic elements, approximately 0.96 Mbits of embedded memory, 266 I/Os, a 484-BBGA (supplier package 484-FBGA, 23×23) footprint, and a low-voltage core supply range of 1.14 V to 1.26 V. The device is RoHS compliant and specified for 0 °C to 85 °C operation.
Key Features
- Logic Capacity — 24,051 logic elements provide programmable resources for implementing complex custom digital functions.
- Embedded Memory — 958,464 bits of on-chip RAM (approximately 0.96 Mbits) support data buffering, state storage, and small lookup table structures.
- I/O Count — 266 user I/O pins enable dense connectivity to external peripherals, sensors, and interfaces.
- Power and Voltage — Core supply specified between 1.14 V and 1.26 V for integration with low-voltage system rails.
- Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact board-level integration.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to meet commercial application environments.
- Regulatory Compliance — RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Custom digital logic — Use the device to implement bespoke finite state machines, protocol handlers, and parallel processing blocks where specific logic density and I/O count are required.
- Peripheral and I/O aggregation — Consolidate multiple external interfaces and glue logic into a single device using the 266 I/Os and embedded memory for buffering.
- Prototyping and development — Leverage the programmable fabric and on-chip resources for iterative hardware development and verification at commercial operating conditions.
Unique Advantages
- High logic integration: 24,051 logic elements reduce the need for multiple discrete CPLDs or glue logic components.
- Significant on-chip RAM: Approximately 0.96 Mbits of embedded memory enables local data storage and buffering without external SRAM.
- Extensive I/O availability: 266 I/Os provide flexibility for dense peripheral connections and interface implementations.
- Compact BGA footprint: 484-BBGA / 484-FBGA (23×23) packaging supports space-constrained PCB designs while maintaining high pin count.
- Low-voltage core operation: Narrow supply range (1.14 V–1.26 V) suitable for integration with low-voltage system power domains.
- Commercial temperature rating and RoHS compliance: Ready for standard commercial deployments and compliant with RoHS requirements.
Why Choose XC6SLX25-2FG484C?
The XC6SLX25-2FG484C Spartan-6 LX FPGA delivers a balanced combination of logic density, embedded memory, and I/O resources in a compact 484-BBGA package. Its specifications—24,051 logic elements, approximately 0.96 Mbits of on-chip RAM, 266 I/Os, and a controlled core voltage range—make it suitable for designers seeking a programmable, commercial-grade solution for consolidating digital functions.
This device is a practical choice for teams that require measurable on-chip resources and a high pin count within a surface-mount BGA footprint, providing a clear path to implement configurable logic and interface aggregation in commercial temperature applications.
Request a quote or submit your inquiry to receive pricing and availability for the XC6SLX25-2FG484C. Our team will respond with the details you need to move your design forward.

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