XC6SLX25-2FG484C

IC FPGA 266 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA

Quantity 407 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O266Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC6SLX25-2FG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA

The XC6SLX25-2FG484C is an AMD Spartan®-6 LX field programmable gate array supplied in a 484-BBGA package. This commercial-grade FPGA integrates a substantial logic capacity together with on-chip memory and a large number of I/O pins to address a wide range of programmable digital designs.

Key characteristics include 24,051 logic elements, approximately 0.96 Mbits of embedded memory, 266 I/Os, a 484-BBGA (supplier package 484-FBGA, 23×23) footprint, and a low-voltage core supply range of 1.14 V to 1.26 V. The device is RoHS compliant and specified for 0 °C to 85 °C operation.

Key Features

  • Logic Capacity — 24,051 logic elements provide programmable resources for implementing complex custom digital functions.
  • Embedded Memory — 958,464 bits of on-chip RAM (approximately 0.96 Mbits) support data buffering, state storage, and small lookup table structures.
  • I/O Count — 266 user I/O pins enable dense connectivity to external peripherals, sensors, and interfaces.
  • Power and Voltage — Core supply specified between 1.14 V and 1.26 V for integration with low-voltage system rails.
  • Package and Mounting — 484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact board-level integration.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C to meet commercial application environments.
  • Regulatory Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

  • Custom digital logic — Use the device to implement bespoke finite state machines, protocol handlers, and parallel processing blocks where specific logic density and I/O count are required.
  • Peripheral and I/O aggregation — Consolidate multiple external interfaces and glue logic into a single device using the 266 I/Os and embedded memory for buffering.
  • Prototyping and development — Leverage the programmable fabric and on-chip resources for iterative hardware development and verification at commercial operating conditions.

Unique Advantages

  • High logic integration: 24,051 logic elements reduce the need for multiple discrete CPLDs or glue logic components.
  • Significant on-chip RAM: Approximately 0.96 Mbits of embedded memory enables local data storage and buffering without external SRAM.
  • Extensive I/O availability: 266 I/Os provide flexibility for dense peripheral connections and interface implementations.
  • Compact BGA footprint: 484-BBGA / 484-FBGA (23×23) packaging supports space-constrained PCB designs while maintaining high pin count.
  • Low-voltage core operation: Narrow supply range (1.14 V–1.26 V) suitable for integration with low-voltage system power domains.
  • Commercial temperature rating and RoHS compliance: Ready for standard commercial deployments and compliant with RoHS requirements.

Why Choose XC6SLX25-2FG484C?

The XC6SLX25-2FG484C Spartan-6 LX FPGA delivers a balanced combination of logic density, embedded memory, and I/O resources in a compact 484-BBGA package. Its specifications—24,051 logic elements, approximately 0.96 Mbits of on-chip RAM, 266 I/Os, and a controlled core voltage range—make it suitable for designers seeking a programmable, commercial-grade solution for consolidating digital functions.

This device is a practical choice for teams that require measurable on-chip resources and a high pin count within a surface-mount BGA footprint, providing a clear path to implement configurable logic and interface aggregation in commercial temperature applications.

Request a quote or submit your inquiry to receive pricing and availability for the XC6SLX25-2FG484C. Our team will respond with the details you need to move your design forward.

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