XC6SLX25-2FGG484I

The XC6SLX25-2FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It provides a balance of programmable logic capacity, embedded memory, and a broad I/O complement for industrial-grade embedded designs.

With 24,051 logic elements, approximately 0.96 Mbits of on-chip RAM and 266 user I/O, this device targets applications that require moderate logic integration, flexible interfacing and reliable operation across an extended industrial temperature range.

Key Features

• Core Logic 24,051 logic elements support the implementation of custom digital logic, state machines and hardware accelerators.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM enable buffering, FIFOs and local data storage without immediate need for external memory.
• I/O Capacity 266 user I/O pins provide broad connectivity options for sensors, peripherals and bus interfaces.
• Power Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Package & Mounting 484-BBGA package (supplier package: 484-FBGA, 23 × 23) in a surface-mount form factor for compact PCB integration.
• Operating Range Industrial-grade operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control Leverage the device’s industrial temperature range and large I/O count for machine control, PLC extensions and automation interfaces.
• Embedded System Integration Use programmable logic and on-chip RAM to consolidate glue logic, protocol bridging and custom peripherals in compact embedded designs.
• Test & Measurement Implement signal processing blocks, data capture buffers and custom timing logic using the available logic elements and embedded memory.
• I/O Expansion and Interface Bridging High I/O count enables aggregation and translation between multiple digital buses and peripheral interfaces on a single FPGA.

Unique Advantages

• High logic capacity: 24,051 logic elements let you integrate substantial custom logic and state machines, reducing the need for multiple discrete devices.
• On-chip buffering: Approximately 0.96 Mbits of embedded RAM supports local data storage and FIFO implementations to simplify board-level memory design.
• Wide I/O availability: 266 user I/O pins provide flexibility to connect numerous peripherals and interfaces directly to the FPGA.
• Industrial robustness: Rated for −40 °C to 100 °C operation, enabling deployment in temperature-challenging environments.
• Compact surface-mount package: 484-BBGA (23 × 23) helps minimize PCB area while supporting high pin count implementations.
• Environmentally compliant: RoHS compliance supports regulatory requirements for many commercial and industrial products.

Why Choose XC6SLX25-2FGG484I?

The XC6SLX25-2FGG484I positions itself as a practical, industrial-grade FPGA option for designs that demand a solid balance of logic resources, embedded memory and extensive I/O in a compact BGA package. Its specified core voltage range and extended operating temperature make it suitable for a wide range of embedded and industrial applications.

Designed for engineering teams seeking to consolidate digital functions, implement custom interfaces and maintain reliable operation in challenging environments, the device provides clear, verifiable specifications that support predictable integration and deployment.

Request a quote or submit a request to obtain pricing and availability information for the XC6SLX25-2FGG484I. Our team can provide the details you need to move your design forward.