XC6SLX25-2FTG256I

The XC6SLX25-2FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, supplied in a 256-LBGA package. It delivers a mix of programmable logic, embedded memory and I/O capacity aimed at industrial applications that require reconfigurable hardware.

With 24,051 logic elements, 1,879 configurable logic blocks (CLBs) and 958,464 bits of on-chip RAM, this device supports custom digital functions while operating across a 1.14 V to 1.26 V core voltage range and an industrial temperature range of -40°C to 100°C.

Key Features

• Programmable Logic Capacity — 24,051 logic elements and 1,879 CLBs provide the programmable fabric needed for implementing custom logic and state machines.
• Embedded Memory — 958,464 bits of on-chip RAM (approximately 0.96 Mbits) for buffering, lookup tables and small embedded data storage.
• I/O Density — 186 I/O pins to interface with peripherals, sensors and external devices.
• Power Supply — Core voltage specified from 1.14 V to 1.26 V to match system power rails.
• Package and Mounting — 256-LBGA (supplier device package: 256-FTBGA 17×17) with surface-mount mounting type for board-level integration.
• Industrial Temperature Range — Rated for operation from -40°C to 100°C for deployment in industrial environments.
• Regulatory Compliance — RoHS compliant for reduced hazardous substance content.

Typical Applications

• Industrial Control — Use the programmable logic and up to 186 I/Os along with embedded RAM to implement custom control, timing and interface functions in industrial systems.
• Embedded Systems — Deploy the device as a reconfigurable processing element where 24,051 logic elements and on-chip RAM support application-specific logic and data buffering.
• I/O Expansion and Protocol Bridging — Leverage the I/O count and programmable fabric to implement protocol translators or I/O concentrators within constrained board space.

Unique Advantages

• Balanced Logic and Memory — Combines 24,051 logic elements with nearly 0.96 Mbits of embedded RAM to support both logic-intensive and data buffering tasks on a single device.
• High I/O Count — 186 I/Os enable broad connectivity to external sensors, actuators and peripherals without external glue logic.
• Industrial-Grade Temperature Capability — Rated from -40°C to 100°C to meet the thermal demands of industrial deployments.
• Standard BGA Package — 256-LBGA (17×17 FTBGA) surface-mount package supports compact board layouts and dense system integration.
• Regulatory Compatibility — RoHS compliance supports designs targeting markets and customers with hazardous-substance restrictions.

Why Choose XC6SLX25-2FTG256I?

The XC6SLX25-2FTG256I positions itself as a versatile, industrial-grade FPGA option that combines substantial programmable logic, embedded memory and a high I/O count in a compact 256-LBGA package. Its voltage and temperature specifications make it suitable for designs that require reliable operation across typical industrial power and thermal ranges.

System designers and OEMs seeking a reconfigurable hardware element for industrial and embedded applications will find this device useful for consolidating custom logic, expanding I/O capability and implementing on-chip data buffering while maintaining RoHS compliance.

Request a quote or submit a request for pricing to begin integrating the XC6SLX25-2FTG256I into your next design.