XC6SLX25-3CSG324I

The XC6SLX25-3CSG324I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) offered in a 324-pin LFBGA/CSPBGA package. It provides a programmable hardware platform with substantial logic capacity, embedded memory, and a high count of I/O suitable for industrial-grade designs.

With industrial temperature grading and a controlled core voltage range, this device addresses applications that require robust operation across a wide temperature span while offering flexible, reconfigurable logic resources.

Key Features

• Programmable Logic Capacity  Provides 24,051 logic elements for implementing custom digital circuits and control logic.
• Embedded Memory  Includes approximately 0.96 Mbits of on-chip RAM (958,464 bits) for data buffering, LUT-based storage, and small caches.
• I/O Resources  Offers 226 user I/O pins to interface with sensors, actuators, peripherals and external devices.
• Power  Core supply range specified at 1.14 V to 1.26 V to match system power design requirements.
• Package & Mounting  324-LFBGA (324-CSPBGA, 15 × 15 mm) package in a surface-mount form factor for compact board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS compliant for adherence to environmental requirements.

Typical Applications

• Industrial Control and Automation  Use the device’s reconfigurable logic and wide operating temperature range to implement motor control, PLC functions, and factory automation interfaces.
• Embedded Prototyping and Custom Logic  Leverage 24,051 logic elements and embedded RAM for hardware prototyping, algorithm offload, and custom digital accelerators.
• I/O Aggregation and Peripheral Bridging  226 I/O pins enable consolidation of multiple peripherals and protocol bridging in compact designs.

Unique Advantages

• High logic density: 24,051 logic elements give designers the space to implement complex state machines, datapaths, and control logic without immediate migration to larger devices.
• On-chip RAM for fast data handling: Approximately 0.96 Mbits of embedded memory supports buffering and temporary storage needs without external memory in many use cases.
• Extensive I/O flexibility: 226 I/O pins simplify system integration by reducing the need for additional interface components.
• Industrial temperature support: Rated from −40 °C to 100 °C, enabling deployment in harsh or temperature-variable environments.
• Compact BGA package: The 324-CSPBGA (15 × 15 mm) footprint facilitates dense board layouts while maintaining high connection density.
• Environmental compliance: RoHS compliance helps meet regulatory requirements for many product lines.

Why Choose XC6SLX25-3CSG324I?

The XC6SLX25-3CSG324I combines substantial programmable logic, embedded memory, and a high I/O count in an industrial-grade LFBGA package, offering a balanced platform for mid-density FPGA designs. Its specified core voltage range and extended operating temperature make it suitable for applications that require reliable, reconfigurable logic in challenging environments.

This device is well suited to engineers and procurement teams designing industrial control systems, embedded prototypes, and I/O-intensive applications who need a compact, RoHS-compliant FPGA with clear, verifiable specifications for logic capacity, memory, I/O, package, and temperature performance.

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