XC6SLX25-3FGG484C

The XC6SLX25-3FGG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for commercial-grade embedded logic applications. It combines a sizeable logic fabric with on-chip memory and a high pin-count package to address mid-density programmable logic requirements.

Key device attributes include approximately 24,051 logic elements, approximately 0.96 Mbits of embedded memory, 266 user I/O, a 484-BBGA (484-FBGA, 23×23) package, a supply voltage range of 1.14 V to 1.26 V, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface-mount assembly.

Key Features

• Core Logic  Approximately 24,051 logic elements provide a flexible fabric for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
• I/O Capacity  266 user I/O pins to support multiple external interfaces, parallel buses, and extensive peripheral connectivity.
• Power  Voltage supply range of 1.14 V to 1.26 V for the core, allowing integration into systems designed around this supply window.
• Package and Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor suitable for dense PCB layouts.
• Temperature and Grade  Commercial operating range of 0 °C to 85 °C; intended for commercial-grade applications.
• Environmental Compliance  RoHS compliant for restricted-substance conformance in applicable markets.

Typical Applications

• Embedded Logic Acceleration  Use the device’s approximately 24,051 logic elements and on-chip RAM to implement custom control, processing, and glue-logic functions in commercial designs.
• I/O-Intensive Interfaces  With 266 user I/O, support multiple parallel interfaces, sensor arrays, or peripheral busses requiring significant external connectivity.
• Prototype and Low- to Mid-Volume Deployments  The surface-mount 484-BBGA package and commercial temperature grade suit development platforms and production runs where a balance of integration and cost is required.

Unique Advantages

• Substantial Logic Capacity: Approximately 24,051 logic elements give designers room to implement complex state machines, datapaths, and control logic without immediate migration to larger devices.
• On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• High I/O Count: 266 user I/O pins simplify interface consolidation and reduce the need for external I/O expanders.
• Compact, Surface-Mount Package: The 484-BBGA (484-FBGA, 23×23) package enables dense PCB layouts while maintaining a high pin count.
• Commercial Grade and RoHS Compliant: Designed for commercial operating environments (0 °C to 85 °C) and meets RoHS environmental requirements.

Why Choose XC6SLX25-3FGG484C?

The XC6SLX25-3FGG484C is positioned for designers who need a balanced, mid-density FPGA solution from AMD’s Spartan®-6 LX family. Its combination of roughly 24k logic elements, close to 1 Mbit of embedded RAM, and 266 I/O in a 484-BBGA surface-mount package delivers integration and flexibility for commercial embedded systems.

This device is well suited to teams seeking a commercially graded, RoHS-compliant FPGA for applications that require moderate logic capacity, significant I/O resources, and on-chip memory—providing a scalable option for development and production where those capabilities align with system requirements.

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