XC6SLX25-3FT256C

The XC6SLX25-3FT256C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides reconfigurable logic with 24,051 logic elements, approximately 0.96 Mbits of embedded memory, and 186 general-purpose I/O pins in a 256‑FTBGA (17×17) package.

Designed for commercial-grade applications, this surface-mount FPGA operates from a supply voltage of 1.14 V and across an ambient range of 0 °C to 85 °C, packaged and shipped in tray format.

Key Features

• Core Logic  24,051 logic elements provide programmable combinational and sequential resources for custom digital designs.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM to support buffering, state storage, and small lookup tables.
• I/O Capacity  186 I/O pins allow flexible interfacing with external peripherals, sensors, and other digital subsystems.
• Power  Specified supply voltage of 1.14 V for the core to match system power planning and regulator design.
• Package and Mounting  256‑FTBGA (17×17) supplier device package in tray format; surface-mount mounting type for PCB assembly.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C, suitable for commercial electronics environments.
• Manufacturer  Produced by AMD and supplied in tray packaging for volume board assembly.

Typical Applications

• Commercial Embedded Systems  Reconfigurable logic for control, data handling, and protocol implementation within commercial-temperature designs.
• Prototyping and Development  Platform for evaluating custom logic functions using 24,051 logic elements and on-chip RAM resources.
• I/O-Driven Interfaces  Suitable where designs require up to 186 I/O connections for external device interfacing and signal routing.

Unique Advantages

• Balanced Logic and Memory  Combines 24,051 logic elements with approximately 0.96 Mbits of embedded RAM to support mixed logic and buffering needs without immediate external memory.
• High I/O Count  186 available I/O pins help consolidate multiple peripheral connections and simplify board-level routing.
• Compact BGA Package  256‑FTBGA (17×17) package provides a compact footprint for dense PCB designs while enabling surface-mount assembly.
• Commercial Temperature Support  Rated for 0 °C to 85 °C operation, aligning with commercial electronics deployment requirements.
• Single Vendor Source  Manufactured by AMD, facilitating procurement and parts consistency for production runs.

Why Choose XC6SLX25-3FT256C?

The XC6SLX25-3FT256C positions itself as a capable commercial-grade FPGA option where a balance of programmable logic, embedded memory, and I/O density is required. Its specification set—24,051 logic elements, roughly 0.96 Mbits of on-chip RAM, and 186 I/O—supports a wide range of custom logic tasks without immediate reliance on large external memories.

This part is suitable for design teams and procurement looking for an AMD Spartan®-6 LX device in a 256‑FTBGA package that fits surface-mount assembly flows and commercial temperature profiles, offering predictable integration into existing board designs and production processes.

Request a quote or submit a purchase inquiry to obtain pricing and availability for XC6SLX25-3FT256C.