XC6SLX25-3FG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 266 958464 24051 484-BBGA |
|---|---|
| Quantity | 722 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 266 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1879 | Number of Logic Elements/Cells | 24051 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC6SLX25-3FG484C – Spartan®-6 LX Field Programmable Gate Array (FPGA) IC
The XC6SLX25-3FG484C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a compact 484-BBGA package. It combines a substantial logic capacity and embedded RAM with a high I/O count to support a range of commercial electronic designs.
Key on-chip resources include 24,051 logic elements, approximately 0.96 Mbits of embedded memory, and 266 I/O pins. The device is a surface-mount, commercial-grade FPGA with a specified core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Logic Capacity 24,051 logic elements suitable for implementing moderate-complexity digital functions and custom logic.
- Embedded Memory Approximately 0.96 Mbits of on-chip RAM to support data buffering, small FIFOs, and local storage.
- I/O Resources 266 general-purpose I/O pins for interfacing to sensors, peripherals, and external logic.
- Power Core voltage supply range of 1.14 V to 1.26 V to match system power domains and enable consistent device operation.
- Package and Mounting 484-BBGA package (supplier package listed as 484-FBGA, 23×23) optimized for surface-mount assembly.
- Temperature and Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Regulatory RoHS compliant for lead-free manufacturing and environmental considerations.
Unique Advantages
- Substantial logic density: 24,051 logic elements provide the capacity to consolidate multiple discrete functions into a single FPGA.
- On-chip memory: Approximately 0.96 Mbits of embedded RAM reduces dependence on external memory for small buffers and temporary storage.
- High I/O count: 266 I/Os simplify integration with multiple peripherals and parallel interfaces without extensive external buffering.
- Compact BGA footprint: 484-BBGA / 484-FBGA (23×23) packaging enables dense PCB layouts and surface-mount assembly.
- Commercial-grade range: Specified for 0 °C to 85 °C operation to match standard commercial electronic product requirements.
- RoHS compliant: Supports environmentally conscious manufacturing processes.
Why Choose XC6SLX25-3FG484C?
The XC6SLX25-3FG484C balances logic capacity, embedded memory, and I/O resources in a surface-mount BGA package, making it well suited for commercial electronic designs that require consolidated digital logic and flexible interfacing. Its defined supply voltage range and commercial operating temperature make it appropriate for a wide set of standard embedded applications.
Backed by AMD's Spartan‑6 family, this FPGA provides a measurable combination of on-chip resources and packaging that supports scalable designs and predictable integration into production assemblies.
Request a quote or submit your requirements to receive pricing and availability for the XC6SLX25-3FG484C.

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