XC6SLX25-3FT256I

The XC6SLX25-3FT256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It delivers 24,051 logic elements and approximately 0.96 Mbits of embedded memory in a compact 256-LBGA package.

Targeted at industrial applications and embedded designs, this device provides 186 I/O pins, a surface-mount 256-FTBGA (17×17) package, RoHS compliance, and operation across a wide temperature range (−40°C to 100°C). The device core supply range is 1.14 V to 1.26 V.

Key Features

• Logic Capacity  24,051 logic elements for implementing moderate to complex custom logic and control functions.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM to store buffers, state machines, and small data sets without external memory.
• I/O Resources  186 user I/O pins to support multiple peripherals, sensors, and external interfaces.
• Power Supply  Core supply range of 1.14 V to 1.26 V for compatibility with targeted power architectures.
• Package & Mounting  256-LBGA (supplier device package: 256-FTBGA, 17×17) in a surface-mount form factor to minimize PCB footprint.
• Temperature & Grade  Industrial grade operation from −40°C to 100°C for use in demanding environments.
• Environmental Compliance  RoHS compliant for environmentally regulated designs.

Typical Applications

• Industrial control and automation  Leverages the industrial temperature range and abundant I/O to interface with sensors, actuators, and control networks.
• Embedded system prototyping  Provides sufficient logic and on-chip memory for development and evaluation of custom logic and system prototypes.
• Interface bridging and protocol logic  High I/O count supports implementing protocol translators, bus controllers, and custom interface logic.

Unique Advantages

• High logic density: 24,051 logic elements enable implementation of substantial custom logic without immediate need for higher-tier devices.
• On-chip memory reduces BOM: Approximately 0.96 Mbits of embedded RAM helps minimize reliance on external memory components.
• Generous I/O count: 186 I/Os provide flexibility to connect multiple peripherals and external devices directly.
• Industrial-grade reliability: Specified operation from −40°C to 100°C supports deployment in temperature-variable environments.
• Compact surface-mount package: 256-LBGA (17×17) saves PCB area while supporting high pin count routing.
• RoHS compliant: Meets common environmental requirements for commercial and industrial products.

Why Choose XC6SLX25-3FT256I?

The XC6SLX25-3FT256I balances logic capacity, embedded memory, and I/O resources in a compact industrial-grade package, making it suitable for embedded designs that need moderate programmable logic and reliable operation across wide temperatures. With a focused core supply range and surface-mount 256-LBGA package, it supports compact board layouts and straightforward power architectures.

This FPGA is appropriate for engineers and procurement teams building industrial control systems, interface logic, and embedded prototypes that require a verified combination of logic elements, memory, and I/O in an AMD Spartan®-6 LX device that is RoHS compliant and rated for −40°C to 100°C operation.

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