XC6SLX25-L1FTG256I

The XC6SLX25-L1FTG256I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD. It provides 24,051 logic elements, approximately 0.96 Mbits of embedded memory, and 186 user I/O in a compact 256-LBGA surface-mount package.

Designed for industrial applications, this device supports a supply voltage range of 1.14 V to 1.26 V and an operating temperature range of -40 °C to 100 °C, delivering programmable logic and I/O density where board-level integration and temperature tolerance are required.

Key Features

• Core Capacity 24,051 logic elements provide the programmable fabric needed for custom logic, control functions, and glue-logic integration on system boards.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM to support buffering, FIFOs, and small data stores within user logic.
• I/O 186 user I/O pins available for interfacing with peripherals, sensors, and external devices.
• Power Operates from a core supply range of 1.14 V to 1.26 V, allowing designers to match system power rails and downstream power management.
• Package & Mounting 256‑LBGA package (supplier device package: 256‑FTBGA, 17×17) in a surface‑mount form factor for board-level assembly and compact layouts.
• Temperature & Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C for use in temperature-demanding environments.
• Environmental Compliance RoHS compliant for adherence to common environmental and manufacturing directives.

Typical Applications

• Industrial Control Implement custom control logic, I/O aggregation, and deterministic state machines using the device’s logic capacity and industrial temperature rating.
• Embedded Processing Offload Use the on-chip RAM and logic elements to offload timing‑sensitive or parallel tasks from a host processor.
• Communications & Interface Bridging Leverage 186 user I/O pins to implement protocol conversion, parallel interfaces, or peripheral multiplexing at the board level.
• Prototyping & Board-Level Integration The surface‑mount 256‑LBGA package supports compact PCB designs for development and integration into production hardware.

Unique Advantages

• Substantial Logic Density: 24,051 logic elements enable complex custom logic implementations without external FPGA resources.
• Embedded Memory On-Die: Approximately 0.96 Mbits of RAM reduces the need for some external memory components and simplifies board routing for small data buffers.
• Generous I/O Count: 186 user I/O pins provide flexibility for interfacing multiple peripherals and sensors directly to the FPGA.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to meet the thermal demands of industrial deployments.
• Compact Surface-Mount Package: 256‑LBGA (256‑FTBGA, 17×17) supports high-density PCB layouts while keeping board footprint minimized.
• RoHS Compliant: Meets common environmental manufacturing requirements for lead-free assembly.

Why Choose XC6SLX25-L1FTG256I?

The XC6SLX25-L1FTG256I delivers a balanced combination of logic capacity, on-chip memory, and I/O resources in an industrial-grade, surface-mount FPGA package. Its specified core voltage range and wide operating temperature make it suitable for designs that require reliable programmable logic at the board level.

This device is well suited to engineers and procurement teams building industrial control systems, interface bridges, or embedded processing offload solutions who need clear, verifiable device characteristics such as logic density, memory size, I/O count, package style, and environmental ratings.

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