XC6SLX25-3FTG256C

The XC6SLX25-3FTG256C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD in a 256-LBGA surface-mount package. It provides a balanced combination of programmable logic, embedded memory and I/O capacity for commercial embedded designs and development projects.

Designed for commercial-grade applications, the device operates from a 1.14 V to 1.26 V supply and is specified for an ambient operating temperature range of 0 °C to 85 °C. It is RoHS compliant and supplied in a compact 256-FTBGA (17×17) package.

Key Features

• Core logic — 1,879 CLBs delivering 24,051 logic elements to implement custom logic, state machines and processing pipelines.
• Embedded memory — Approximately 0.96 Mbits of on-chip RAM for buffering, FIFOs and small data storage requirements.
• I/O capacity — 186 user I/O pins suitable for connecting peripherals, buses and external devices.
• Power and supply — Operates from a 1.14 V to 1.26 V core supply to match target system power domains.
• Package and mounting — 256-pin LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor to support compact board layouts.
• Commercial grade and environmental — Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Typical Applications

• Consumer electronics — Implement custom logic for device control, audio/video processing blocks, and interface bridging in consumer products.
• Prototyping and development — Rapid hardware prototyping and algorithm validation using reprogrammable logic and embedded RAM.
• Communications equipment — Interface adaptation, protocol handling and glue-logic tasks where moderate logic density and ample I/O are required.
• Instrumentation and test — Custom timing, signal conditioning logic and data buffering for test equipment and measurement systems.

Unique Advantages

• High logic capacity: 24,051 logic elements enable implementation of substantial custom logic without external ASICs.
• On-chip memory: Approximately 0.96 Mbits of embedded RAM reduces reliance on external memory for many buffering and queueing tasks.
• Wide I/O availability: 186 I/O pins provide flexibility to connect multiple peripherals, buses and mezzanine interfaces.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) supports dense PCB layouts and space-constrained designs.
• Commercial operating range and RoHS compliance: Specified 0 °C to 85 °C operation and RoHS status support standard commercial product requirements.
• Low-voltage core operation: 1.14 V–1.26 V supply supports modern low-voltage system architectures.

Why Choose XC6SLX25-3FTG256C?

The XC6SLX25-3FTG256C positions itself as a versatile Spartan®-6 LX FPGA option for commercial embedded designs that require a balance of logic density, embedded memory and I/O in a compact BGA package. Its combination of 1,879 CLBs, 24,051 logic elements and approximately 0.96 Mbits of on-chip RAM makes it suited to applications that need substantial programmable logic without moving to larger device classes.

This device is appropriate for engineers and teams working on consumer electronics, communications equipment, test instruments and rapid prototyping projects who require a commercial-grade, RoHS-compliant FPGA in a surface-mount 256-LBGA footprint.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX25-3FTG256C.