XC6SLX25-2FT256I

The XC6SLX25-2FT256I is a Spartan®-6 LX field programmable gate array from AMD, delivering reconfigurable digital logic in a compact surface-mount package. It combines 24,051 logic elements with approximately 0.96 Mbits of embedded RAM and 186 user I/O pins to support designs that require on-chip memory, dense I/O connectivity, and flexible logic implementation.

Specified for industrial use with an operating range of −40 °C to 100 °C, a 1.14 V–1.26 V core supply range, and RoHS compliance, this device is targeted at applications that need reliable, reconfigurable hardware in a high-density 256-LBGA footprint.

Key Features

• Logic Capacity — 24,051 logic elements provide the implementation capacity required for complex custom digital designs and control logic.
• Embedded Memory — Approximately 0.96 Mbits (958,464 bits) of on-chip RAM suitable for buffering, FIFOs, and small embedded data stores.
• I/O Resources — 186 user I/O pins enable direct interfacing to peripherals, sensors, and external devices without excessive external glue logic.
• Power — Core operating voltage range of 1.14 V to 1.26 V to match common FPGA core supply domains.
• Package & Mounting — 256-LBGA surface-mount package (supplier package: 256-FTBGA, 17×17) for compact, high-density PCB layouts.
• Temperature & Grade — Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Industrial Control — Implement machine control, sequencing, and protocol handling where extended temperature range and industrial grade operation are required.
• Custom Digital Logic & Prototyping — Realize and iterate custom logic functions, state machines, and control algorithms using the device's logic resource pool and on-chip RAM.
• I/O Aggregation and Interface Bridging — Consolidate multiple peripheral interfaces and perform protocol translation using the device's 186 I/O pins.
• Embedded Buffering and Data Path — Use the on-chip memory to buffer streaming data, implement FIFOs, or maintain small data sets near logic functions.

Unique Advantages

• High Logic Density: 24,051 logic elements give designers room to implement complex combinational and sequential logic without extensive external components.
• Integrated On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces the need for external memory for small-to-medium buffering tasks.
• Extensive I/O Count: 186 I/O pins minimize external interface components and simplify board-level signal routing.
• Industrial Temperature Support: −40 °C to 100 °C rating enables deployment in demanding environmental conditions.
• Compact, High-Density Packaging: 256-LBGA (256-FTBGA, 17×17) supports dense PCB integration while maintaining surface-mount manufacturing compatibility.
• Low-Voltage Core: Narrow core supply range (1.14 V–1.26 V) aids predictable power-domain design in multi-voltage systems.

Why Choose XC6SLX25-2FT256I?

The XC6SLX25-2FT256I delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact industrial-grade LBGA package. It is well suited for engineers and procurement teams seeking a reconfigurable solution that fits space-constrained PCBs while meeting extended temperature and RoHS requirements.

Manufactured by AMD and available in a 256-LBGA surface-mount form, this FPGA is designed to support reliable, reconfigurable implementations where on-chip memory, significant logic resources, and extensive I/O are required.

If you would like a quote or additional purchasing information for the XC6SLX25-2FT256I, please request a quote or submit an inquiry to sales.