XC6SLX25-N3FTG256I

The XC6SLX25-N3FTG256I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, provided in a 256-ball LBGA package. It delivers programmable logic resources, embedded memory, and a substantial I/O count in a compact surface-mount package targeted for industrial applications.

Key on-chip resources include 24,051 logic elements and approximately 0.96 Mbits of embedded memory, with supply voltage and temperature ranges specified for industrial use.

Key Features

• FPGA Core  Spartan-6 LX family FPGA architecture supplied by AMD, providing reprogrammable logic in a single device.
• Logic Capacity  24,051 logic elements to implement custom digital functions and state machines.
• Configurable Logic Blocks (CLBs)  1,879 CLBs available for building combinational and sequential logic structures.
• Embedded Memory  Approximately 0.96 Mbits of on-chip RAM for data buffering, FIFOs, and local storage.
• I/O  186 user I/O pins to interface with external devices, sensors, and peripherals.
• Power  Core supply voltage range from 1.14 V to 1.26 V for device operation.
• Package & Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount format suited for dense PCBs.
• Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
• Environmental  RoHS compliant for lead-free and environmentally conscious designs.

Typical Applications

• Industrial Control  Use programmable logic to implement control algorithms and interface logic within industrial systems operating across an extended temperature range.
• Instrumentation & Test Equipment  Implement custom digital processing and I/O aggregation in lab and field instruments where compact, surface-mount packages are required.
• Embedded System Prototyping  Provide a development platform for designers requiring reprogrammable logic, moderate on-chip memory, and a substantial I/O count.

Unique Advantages

• Balanced Logic and Memory: 24,051 logic elements with approximately 0.96 Mbits of embedded RAM support a wide range of mid-size logic designs without external memory for many functions.
• High I/O Count: 186 I/Os enable flexible interfacing and integration with multiple peripherals and sensors on a single FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet the needs of industrial environments.
• Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) allows for dense PCB layouts and space-constrained applications.
• Controlled Core Voltage: Defined supply range (1.14 V to 1.26 V) simplifies power budgeting and regulator selection for the FPGA core.
• RoHS Compliant: Contributes to regulatory and environmental compliance goals.

Why Choose XC6SLX25-N3FTG256I?

The XC6SLX25-N3FTG256I combines moderate logic capacity, on-chip memory, and a high I/O count in a compact 256-LBGA surface-mount package, making it suitable for industrial designs that require programmable logic and reliable operation across an extended temperature range. Its specified core voltage range and RoHS compliance help simplify system integration and regulatory considerations.

This device is well suited for design teams and OEMs targeting industrial controls, instrumentation, and embedded system prototypes that need reprogrammable logic resources with predictable electrical and thermal characteristics.

Request a quote or submit a parts inquiry to receive pricing and availability for the XC6SLX25-N3FTG256I. Our team can provide the information you need to move your design forward.