XC6SLX25T-2CSG324I
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 958464 24051 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 31 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1879 | Number of Logic Elements/Cells | 24051 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC6SLX25T-2CSG324I – Spartan®-6 LXT FPGA, 324-LFBGA
The XC6SLX25T-2CSG324I is a Spartan®-6 LXT field programmable gate array (FPGA) in a 324-pin LFBGA/CSPBGA package. It provides a balance of on-chip logic, embedded memory and I/O density targeted for industrial-grade applications that require programmable logic with a defined supply and temperature range.
Key device attributes include 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, 190 I/O pins, and an industrial operating temperature range, making the device suitable where deterministic programmable logic and board-level integration are required.
Key Features
- Core and Architecture Spartan-6 LXT FPGA architecture in an IC package optimized for programmable logic integration.
- Logic Capacity 24,051 logic elements providing room for medium-complexity digital designs and custom logic implementations.
- Configurable Logic Blocks (CLBs) 1,879 CLBs for structured implementation of logic functions and combinational/sequential resources.
- Embedded Memory Approximately 0.96 Mbits (958,464 bits) of on-chip RAM to support buffering, FIFOs and small data stores without external memory.
- I/O Density 190 user I/O pins to interface with peripherals, sensors and board-level signals.
- Package & Mounting 324-LFBGA / 324-CSPBGA (15 × 15 mm) surface-mount package for compact PCB layouts and high pin density.
- Power Specified core voltage supply range from 1.14 V to 1.26 V for predictable power planning.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, supporting deployment in environments requiring extended temperature tolerance.
- Regulatory Compliance RoHS compliant.
Unique Advantages
- Substantial on-chip logic: 24,051 logic elements enable integration of medium-complexity functions on a single FPGA, reducing the need for discrete logic chips.
- On-board memory available: Approximately 0.96 Mbits of embedded RAM supports local buffering and intermediate data storage without immediate reliance on external memory.
- High I/O count: 190 I/O pins provide flexibility for connecting multiple peripherals, sensors or interface buses directly to the FPGA.
- Industrial-grade thermal tolerance: −40 °C to 100 °C operating range suits applications that require reliable operation across wide temperatures.
- Compact, high-density package: 324-pin LFBGA/CSPBGA (15 × 15 mm) enables dense PCB integration while maintaining a wide set of I/O.
- Defined supply range: Core voltage specification of 1.14–1.26 V simplifies power supply design and system-level power budgeting.
Why Choose XC6SLX25T-2CSG324I?
The XC6SLX25T-2CSG324I positions itself as an industrial-grade Spartan-6 LXT FPGA that combines a substantial logic resource set, near-megabit embedded RAM, and a high I/O count in a compact 324-pin package. These characteristics support integration of multiple digital functions on a single device, enabling streamlined board designs where space and deterministic operating range matter.
This device is suitable for engineers and teams designing industrial and embedded systems that require a balance of logic capacity, local memory and robust thermal performance. Its package and electrical specifications offer a practical foundation for medium-complexity programmable logic designs with clear supply and temperature requirements.
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