XC6SLX25T-2FGG484C

The XC6SLX25T-2FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) provided in a 484-ball BGA package. It delivers a mid-range programmable logic resource set suitable for commercial electronic systems that require reconfigurable digital logic and flexible I/O integration.

This device combines a significant number of logic elements, embedded memory, and a broad I/O count with a compact surface-mount 484-BBGA footprint and RoHS compliance, supporting designs with defined power and thermal envelopes.

Key Features

• Logic Capacity — 24,051 logic elements provide a substantial resource pool for implementing custom digital functions and control logic.
• Configurable Logic Blocks (CLBs) — 1,879 CLBs to structure and organize programmable logic resources.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM for buffering, state storage, and small data structures.
• I/O Count — 250 user I/O pins to support dense external interfacing and connectivity options.
• Power Supply — Core voltage specified from 1.14 V to 1.26 V to match system power-budget requirements.
• Package and Mounting — Surface-mount 484-BBGA (supplier device package: 484-FBGA, 23×23) for compact PCB integration.
• Operating Range — Commercial temperature range from 0 °C to 85 °C suitable for typical commercial applications.
• Environmental — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Embedded digital systems — Implement custom control logic and finite-state machines using the device's logic and memory resources.
• Interface bridging — Use the broad set of I/O pins to connect and translate between multiple peripheral interfaces and subsystems.
• Prototyping and development — Deploy reconfigurable logic for validation of digital designs within commercial temperature environments.

Unique Advantages

• Substantial programmable logic: 24,051 logic elements enable consolidation of multiple digital functions into a single FPGA, reducing board-level complexity.
• Integrated on-chip memory: Approximately 0.96 Mbits of embedded RAM reduces reliance on external memory for small buffers and state storage.
• High I/O density: 250 I/O pins provide flexibility for interfacing with sensors, peripherals, and system buses without large external glue logic.
• Compact package: 484-BBGA surface-mount package supports space-constrained PCB layouts while maintaining connectivity.
• Defined power envelope: Core voltage range of 1.14 V to 1.26 V helps designers plan supply rails and power sequencing.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose XC6SLX25T-2FGG484C?

The XC6SLX25T-2FGG484C positions itself as a practical choice for commercial embedded designs that need a balanced mix of logic capacity, on-chip memory, and extensive I/O in a compact BGA package. Its defined voltage and temperature ranges make it straightforward to integrate into typical commercial system power and thermal designs.

Designers and procurement teams seeking a reconfigurable solution with approximately 24k logic elements, near-1 Mbit embedded memory, and 250 I/O in a 484-BBGA form factor will find this Spartan®-6 LXT device aligned with mid-range programmable logic requirements and RoHS-driven manufacturing workflows.

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