XC6SLX25T-3CSG324I
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 958464 24051 324-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,259 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 324-CSPBGA (15x15) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 324-LFBGA, CSPBGA | Number of I/O | 190 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1879 | Number of Logic Elements/Cells | 24051 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 958464 |
Overview of XC6SLX25T-3CSG324I – Spartan®-6 LXT FPGA, 324-LFBGA (Industrial)
The XC6SLX25T-3CSG324I is a Spartan®-6 LXT field-programmable gate array (FPGA) IC from AMD provided in a 324-pin LFBGA (CSPBGA) package. It combines a substantial logic capacity with embedded memory and a broad I/O count, delivered in a surface-mount, industrial-grade device.
This device is specified for operation across an extended temperature range and supports low-voltage core supply levels, making it suitable for designs that require programmable logic integration in industrial environments.
Key Features
- Logic Capacity Contains 24,051 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory Provides approximately 0.96 Mbits of on-chip RAM for data buffering, state storage, and small LUT-based memory structures.
- I/O Resources Offers 190 user I/O pins to support multiple parallel interfaces and external device connections.
- Power Specified core voltage supply range of 1.14 V to 1.26 V to match low-voltage FPGA power domains.
- Package & Mounting 324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board-level integration.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
- Compliance RoHS compliant.
Unique Advantages
- Substantial programmable logic 24,051 logic elements provide headroom for mid-range logic designs without moving to higher-cost families.
- On-chip memory for real-time tasks Approximately 0.96 Mbits of embedded RAM enables local buffering and small data-store implementations, reducing external memory dependence.
- High I/O count 190 I/Os allow flexible interfacing to sensors, peripherals, and parallel buses directly from the FPGA.
- Industrial temperature rating Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
- Compact surface-mount package 324-LFBGA (15×15) CSPBGA packaging minimizes board area while supporting dense I/O routing.
- RoHS compliant Meets common environmental standards for modern manufacturing processes.
Why Choose XC6SLX25T-3CSG324I?
The XC6SLX25T-3CSG324I positions itself as a practical FPGA choice for projects requiring a balance of logic density, embedded memory, and a high I/O count in an industrial-grade package. Its low-voltage core range and surface-mount 324-LFBGA footprint make it suitable for compact, robust board designs.
Designers and procurement teams looking for a programmable-logic device with verifiable on-chip resources, extended temperature capability, and RoHS compliance will find this part appropriate for a range of industrial applications that need reliable, mid-range FPGA performance.
Request a quote or submit your specifications to receive pricing and availability for the XC6SLX25T-3CSG324I. Our team will respond with a tailored quote and lead-time information.

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Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








