XC6SLX25T-3CSG324I

IC FPGA 190 I/O 324CSBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 958464 24051 324-LFBGA, CSPBGA

Quantity 1,259 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC6SLX25T-3CSG324I – Spartan®-6 LXT FPGA, 324-LFBGA (Industrial)

The XC6SLX25T-3CSG324I is a Spartan®-6 LXT field-programmable gate array (FPGA) IC from AMD provided in a 324-pin LFBGA (CSPBGA) package. It combines a substantial logic capacity with embedded memory and a broad I/O count, delivered in a surface-mount, industrial-grade device.

This device is specified for operation across an extended temperature range and supports low-voltage core supply levels, making it suitable for designs that require programmable logic integration in industrial environments.

Key Features

  • Logic Capacity  Contains 24,051 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Provides approximately 0.96 Mbits of on-chip RAM for data buffering, state storage, and small LUT-based memory structures.
  • I/O Resources  Offers 190 user I/O pins to support multiple parallel interfaces and external device connections.
  • Power  Specified core voltage supply range of 1.14 V to 1.26 V to match low-voltage FPGA power domains.
  • Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board-level integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Compliance  RoHS compliant.

Unique Advantages

  • Substantial programmable logic  24,051 logic elements provide headroom for mid-range logic designs without moving to higher-cost families.
  • On-chip memory for real-time tasks  Approximately 0.96 Mbits of embedded RAM enables local buffering and small data-store implementations, reducing external memory dependence.
  • High I/O count  190 I/Os allow flexible interfacing to sensors, peripherals, and parallel buses directly from the FPGA.
  • Industrial temperature rating  Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
  • Compact surface-mount package  324-LFBGA (15×15) CSPBGA packaging minimizes board area while supporting dense I/O routing.
  • RoHS compliant  Meets common environmental standards for modern manufacturing processes.

Why Choose XC6SLX25T-3CSG324I?

The XC6SLX25T-3CSG324I positions itself as a practical FPGA choice for projects requiring a balance of logic density, embedded memory, and a high I/O count in an industrial-grade package. Its low-voltage core range and surface-mount 324-LFBGA footprint make it suitable for compact, robust board designs.

Designers and procurement teams looking for a programmable-logic device with verifiable on-chip resources, extended temperature capability, and RoHS compliance will find this part appropriate for a range of industrial applications that need reliable, mid-range FPGA performance.

Request a quote or submit your specifications to receive pricing and availability for the XC6SLX25T-3CSG324I. Our team will respond with a tailored quote and lead-time information.

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