XC6SLX25T-4CSG324C

The XC6SLX25T-4CSG324C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD supplied in a 324-pin LFBGA (CSPBGA) package. It provides a mid-range logic capacity and on-chip memory for implementing custom digital logic and system interfacing in surface-mount board designs.

Key on-device resources include 24,051 logic elements, approximately 0.96 Mbits of embedded RAM, and 190 I/O pins. The device operates from a 1.14 V to 1.26 V core supply and is rated for commercial temperature operation (0 °C to 85 °C). It is RoHS compliant.

Key Features

• Logic Capacity — 24,051 logic elements for implementing custom digital functions and moderate-complexity designs.
• Configurable Logic Blocks (CLBs) — 1,879 CLBs to structure combinational and sequential logic resources across your design.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM to support buffering, lookup tables, and small data storage directly on the FPGA.
• I/O — 190 user I/O pins suitable for interfacing with peripherals, buses, and board-level signals.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match platform power architectures.
• Package & Mounting — 324-LFBGA (324-CSPBGA, 15×15) surface-mount package optimized for compact board layouts.
• Operating Conditions — Commercial-grade temperature range from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Hardware Prototyping and Development — Flexible FPGA resources enable rapid implementation and iteration of custom digital logic during product development.
• Custom Interface and Bridging — 190 I/O pins support a variety of board-level interfaces and protocol bridging tasks.
• Embedded Memory Tasks — On-chip RAM can be used for buffering, small lookup tables, and data staging close to logic functions.

Unique Advantages

• Right-sized Logic Resource: 24,051 logic elements provide a balance of capacity and cost for mid-range designs without overprovisioning.
• Integrated On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces the need for external memory for many control and buffering functions.
• High I/O Count: 190 I/O pins enable flexible connectivity options and reduce the need for external multiplexing or I/O expanders.
• Compact Surface-Mount Package: 324-LFBGA (15×15 CSPBGA) supports dense board layouts and space-constrained applications.
• Commercial Temperature Rating: Suitable for standard commercial electronics deployed in controlled environments.
• Regulatory Compliance: RoHS compliance simplifies sourcing and environmental conformity for product assemblies.

Why Choose XC6SLX25T-4CSG324C?

The XC6SLX25T-4CSG324C offers a balanced mix of logic capacity, embedded memory, and I/O density in a compact 324-LFBGA package. Its specifications make it well suited for engineers developing mid-complexity FPGA-based solutions where on-chip resources and a high pin count matter for integration and board-level interfacing.

This device is aimed at teams and designs that require modular, reconfigurable logic with adequate memory and connectivity while maintaining commercial temperature operation and RoHS compliance. It provides a scalable option for prototyping and production where these specific electrical, thermal, and package characteristics align with system requirements.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the XC6SLX25T-4CSG324C. Our team can provide lead-time and sourcing details to support your project timeline.