XC6SLX25T-3FGG484I

The XC6SLX25T-3FGG484I is a Spartan®-6 LXT field programmable gate array (FPGA) IC supplied in a 484-BBGA package and specified for industrial use. It provides a balance of logic capacity, on-chip memory, and I/O density suitable for embedded digital designs that require customizable hardware logic and a wide operating temperature range.

Key on-chip resources include 24,051 logic elements and approximately 0.96 Mbits of embedded memory, with up to 250 I/O signals and a low-voltage core supply range, enabling tightly integrated digital processing in space-constrained board designs.

Key Features

• Logic Capacity — 24,051 logic elements provide resources for implementing custom digital functions and combinational/sequential logic.
• Embedded Memory — Approximately 0.96 Mbits (958,464 bits) of on-chip RAM to support data buffering, FIFOs, and small memory structures.
• I/O Density — Up to 250 general-purpose I/O pins to interface with external peripherals, sensors, and high-pin-count systems.
• Package & Mounting — Supplied in a 484-BBGA package (supplier device package: 484-FBGA (23x23)) with surface-mount mounting for compact PCB integration.
• Power — Core voltage supply specified from 1.14 V to 1.26 V for nominal low-voltage operation.
• Operating Temperature — Industrial temperature range from −40 °C to 100 °C for use in environments with wide thermal variation.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Custom Digital Processing — Implementation of tailored logic functions and data paths using 24,051 logic elements and embedded RAM.
• I/O-Intensive Interfaces — Systems requiring many parallel or multiplexed signals can leverage up to 250 I/O pins for sensor, bus, or peripheral connectivity.
• Embedded Control and Glue Logic — Use as programmable glue logic or control finite-state machines where integration and compact packaging are important.

Unique Advantages

• Substantial Logic Resources: 24,051 logic elements enable implementation of complex custom logic without external ASICs.
• On-Chip Memory Availability: Approximately 0.96 Mbits of embedded RAM reduces the need for external memory for moderate buffering and state storage.
• High I/O Count: Up to 250 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in demanding thermal environments.
• Compact BGA Packaging: 484-BBGA (484-FBGA (23x23)) in a surface-mount format supports dense PCB layouts and space-constrained designs.
• Low-Voltage Core: Core supply between 1.14 V and 1.26 V supports lower-power designs and modern board power architectures.

Why Choose XC6SLX25T-3FGG484I?

The XC6SLX25T-3FGG484I positions itself as a practical FPGA choice for embedded designs that require a middle ground of logic capacity, on-chip memory, and high I/O capability in an industrial-grade package. Its combination of 24,051 logic elements, approximately 0.96 Mbits of RAM, and 250 I/O points makes it suitable for applications needing programmable hardware flexibility without excessive board area.

Designed for engineers and procurement teams seeking scalable hardware building blocks, this Spartan®-6 LXT device offers predictable electrical and thermal specifications—core voltage range and wide operating temperature—backed by a RoHS-compliant package for streamlined assembly and regulatory alignment.

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