XC6SLX25T-4FGG484C

The XC6SLX25T-4FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD. It provides a moderate-density FPGA fabric with 1,879 CLBs and 24,051 logic elements, along with embedded RAM and a substantial I/O count for configurable digital designs.

Designed for commercial-temperature applications, the device offers surface-mount packaging in a 484-ball BGA form factor and operates from a core supply range of 1.14 V to 1.26 V. It is RoHS-compliant.

Key Features

• Logic Capacity — 1,879 CLBs and 24,051 logic elements to implement custom digital logic and state machines.
• Embedded Memory — Approximately 0.96 Mbits of on-chip RAM for buffering, FIFOs, and small memory structures.
• I/O Resources — 250 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power — Core supply voltage range from 1.14 V to 1.26 V for core power planning and regulator selection.
• Package and Mounting — 484-ball BGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact PCB designs.
• Temperature and Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant device suitable for environmentally regulated assemblies.

Typical Applications

• Custom Digital Logic — Use the 24,051 logic elements to implement tailored combinational and sequential logic for application-specific functionality.
• Data Buffering and Small Memory Functions — The approximately 0.96 Mbits of embedded RAM supports buffering, FIFOs, and temporary storage close to logic blocks.
• Board-Level I/O Integration — With 250 I/O pins, the device can interface with multiple peripherals and external devices on compact PCBs.

Unique Advantages

• Balanced Logic and Memory — The combination of 1,879 CLBs and approximately 0.96 Mbits of embedded RAM enables mixed logic and small-memory designs without external RAM for many use cases.
• High I/O Count — 250 I/O pins provide flexibility for parallel interfaces, sensor connections, or multiple peripheral buses.
• Compact BGA Packaging — 484-ball BGA in a 23×23 supplier package supports high-density PCB layouts while keeping the module footprint compact.
• Commercial-Grade Operating Range — Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.
• Predictable Core Power — A defined core voltage range (1.14 V–1.26 V) simplifies power-supply design and board-level power budgeting.
• Regulatory Compatibility — RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC6SLX25T-4FGG484C?

The XC6SLX25T-4FGG484C delivers a practical balance of logic capacity, embedded memory, and I/O density in a compact 484-ball BGA package for commercial-temperature FPGA designs. Its specification set—including 1,879 CLBs, 24,051 logic elements, approximately 0.96 Mbits of on-chip RAM, and 250 I/O—makes it well suited to engineers seeking a configurable solution for custom digital functions, buffering, and board-level interfacing.

Backed by AMD's Spartan®-6 LXT family pedigree, the device is RoHS-compliant and designed for surface-mount production in commercial environments. It provides a clear set of electrical and mechanical parameters for robust PCB integration and predictable system behavior.

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