XC6SLX25T-2FGG484I

The XC6SLX25T-2FGG484I is an AMD Spartan®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 484-ball BGA package. It provides a mid-range logic fabric with substantial on-chip memory and high I/O density in a compact surface-mount form factor.

This device is suited to designs that require up to 250 I/O, approximately 0.96 Mbits of embedded memory, and 24,051 logic elements, while operating across an industrial temperature range and meeting RoHS environmental requirements.

Key Features

• Core Logic 24,051 logic elements provide mid-range programmable logic capacity for custom digital functions.
• Embedded Memory Approximately 0.96 Mbits of on-chip RAM for local buffering, state machines, and small data storage.
• I/O Density Up to 250 general-purpose I/O pins to support multiple parallel interfaces and external peripherals.
• Power Core supply voltage range from 1.14 V to 1.26 V for device power planning and regulator selection.
• Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount BGA footprint for compact board integration.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Environmental Compliance RoHS compliant to meet lead-free assembly and regulatory requirements.

Typical Applications

• Industrial Control — Provides high I/O and industrial temperature capability for sensor interfacing, control logic, and machine I/O aggregation.
• Communications and Protocol Bridging — Logic density and plentiful I/O enable custom protocol handling and interface conversion in networking or telecom modules.
• Embedded Systems — On-chip RAM and programmable logic support custom embedded functions, timing-critical glue logic, and peripheral control.
• High-density I/O Modules — Compact 484-BBGA package with 250 I/O pins suits space-constrained boards requiring many external connections.

Unique Advantages

• High I/O Count: 250 I/O pins allow integration of multiple peripherals and external interfaces without additional I/O expanders.
• Substantial Logic Capacity: 24,051 logic elements enable implementation of complex custom logic and parallel processing pipelines.
• On-chip Memory: Approximately 0.96 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in extended-environment and industrial applications.
• Compact BGA Package: 484-BBGA (23×23) surface-mount footprint balances board space and routing capability for dense designs.
• RoHS Compliant: Meets lead-free assembly requirements for modern production processes.

Why Choose XC6SLX25T-2FGG484I?

The XC6SLX25T-2FGG484I offers a balanced combination of logic density, embedded memory, and a high I/O count in a compact 484-BBGA surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for a range of embedded and industrial applications where environmental range and regulatory compliance matter.

Manufactured by AMD, this Spartan-6 LXT FPGA is a practical choice for OEMs and design teams seeking a mid-range programmable device that supports substantial I/O integration and on-chip memory in space-constrained assemblies.

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