XC6SLX25T-2FG484I

IC FPGA 250 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 250 958464 24051 484-BBGA

Quantity 817 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O250Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1879Number of Logic Elements/Cells24051
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits958464

Overview of XC6SLX25T-2FG484I – Spartan®-6 LXT FPGA, 24051 Logic Elements, 250 I/Os

The XC6SLX25T-2FG484I is a Spartan®-6 LXT field programmable gate array (FPGA) offered in a 484-BBGA package and specified for industrial use. It provides a balance of on-chip logic, embedded memory and a high I/O count for configurable digital designs.

This device is targeted at industrial applications that require a wide operating temperature range and a compact surface-mount footprint, while delivering substantial logic capacity and embedded RAM for custom hardware functions.

Key Features

  • Core Architecture Spartan®-6 LXT FPGA architecture in a T-speed grade variant.
  • Logic Capacity 24,051 logic elements and 1,879 configurable logic blocks (CLBs) for implementing custom digital functions.
  • Embedded Memory Approximately 0.96 Mbits of on-chip RAM (958,464 total RAM bits) to support buffers, FIFOs and local data storage.
  • I/O Density 250 user I/Os to accommodate parallel interfaces, signal routing and dense connectivity requirements.
  • Power Core supply range specified from 1.14 V to 1.26 V to match system power design and sequencing requirements.
  • Package & Mounting 484-BBGA (supplier device package: 484-FBGA, 23 × 23 mm) in a surface-mount form factor for compact PCB layouts.
  • Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
  • Environmental Compliance RoHS compliant.

Typical Applications

  • Industrial Control Systems — Leverage the device’s industrial temperature rating and 250 I/Os for motor control, PLC interfaces and factory automation I/O expansion.
  • Embedded System Prototyping — Use the 24,051 logic elements and on-chip RAM to implement custom logic, accelerators and prototype SoC functions.
  • Interface Bridging and Protocol Conversion — High I/O count and configurable logic enable custom bridging between disparate digital interfaces and buses.
  • Instrumentation and Test Equipment — Dense logic and embedded memory support data capture, preprocessing and real-time signal handling in measurement systems.

Unique Advantages

  • Substantial Logic Resource: 24,051 logic elements provide ample capacity for medium-complexity digital designs without external logic.
  • Integrated On-Chip Memory: Approximately 0.96 Mbits of embedded RAM reduces dependency on external memory for buffering and local data storage.
  • High I/O Count: 250 user I/Os simplify board-level connectivity and reduce the need for additional I/O expanders.
  • Industrial-Rated Operation: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
  • Compact BBGA Package: 484-BBGA (23 × 23 mm) surface-mount package enables space-efficient PCB designs.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose XC6SLX25T-2FG484I?

The XC6SLX25T-2FG484I combines a substantial set of logic resources, nearly 1 Mbit of embedded RAM and a high 250-pin I/O count in a compact 484-BBGA package, packaged and specified for industrial operation. Its core supply and temperature specifications make it suitable for robust designs that require predictable electrical and thermal behavior.

This FPGA is well suited for engineering teams building industrial controllers, embedded prototypes and interface-rich systems that benefit from on-chip logic and memory integration, a high-density I/O footprint, and RoHS compliance for streamlined manufacturing.

If you would like pricing or availability, request a quote or submit your requirements to receive a tailored response from our team.

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