XC7A25T-3CPG238E

The XC7A25T-3CPG238E is an Artix‑7 Field Programmable Gate Array (FPGA) packaged in a 238‑pin LFBGA/CSPBGA format. It combines a mid-range logic capacity with on‑chip embedded memory and a defined I/O complement to support a range of configurable digital designs.

This device is specified with an operating supply range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 100 °C, and is RoHS compliant. Key measurable attributes include 23,360 logic elements, approximately 1.66 Mbits of embedded memory, and 112 user I/O pins.

Key Features

• FPGA Core Artix‑7 architecture in a programmable logic device offering 23,360 logic elements for custom digital implementation.
• Logic Capacity 23,360 logic elements and 1,825 logic blocks to accommodate medium‑complexity logic designs and custom accelerators.
• Embedded Memory Approximately 1.66 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
• I/O Resources 112 user I/O pins to interface with peripherals, sensors, and external logic domains.
• Power Supply Core supply range specified at 0.95 V to 1.05 V for predictable power budgeting and system design.
• Package & Mounting 238‑lead LFBGA / CSPBGA package; supplier device package listed as 238‑CSBGA (10×10). Surface mount device for PCB assembly.
• Temperature & Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant, supporting regulatory requirements for lead‑free assemblies.

Unique Advantages

• Measured Logic Density: 23,360 logic elements provide clear, quantifiable capacity for medium‑scale FPGA implementations without ambiguity.
• On‑Chip Memory: Approximately 1.66 Mbits of embedded RAM reduces the need for immediate external memory for buffering and state retention.
• Defined I/O Count: 112 I/O pins enable deterministic planning for peripheral interfaces and FPGA pin assignment early in design.
• Compact, Standard Package: 238‑lead LFBGA/CSPBGA (238‑CSBGA 10×10) supports dense PCB layouts while maintaining surface‑mount assembly compatibility.
• Predictable Power Envelope: A specified core voltage range of 0.95 V to 1.05 V aids in power sequencing and supply design.
• Regulatory & Thermal Bounds: RoHS compliance and a 0 °C to 100 °C operating range provide clear limits for environmental and thermal planning.

Why Choose XC7A25T-3CPG238E?

The XC7A25T-3CPG238E positions itself as a measurable, specification‑driven Artix‑7 FPGA option for engineers who need a defined combination of logic capacity, embedded memory, and I/O in a compact BGA package. Its documented counts—23,360 logic elements, approximately 1.66 Mbits of RAM, and 112 I/O—make it straightforward to evaluate fit against design requirements.

This device is suitable for designs that require a clear bill‑of‑materials decision based on published hardware metrics, with predictable power and thermal envelopes and RoHS compliance for lead‑free assemblies. It supports designers looking for a scalable FPGA option within the stated operating and mounting constraints.

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