XC7A25T-L2CPG238E

IC FPGA 150 I/O 238CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 150 1658880 23360 238-LFBGA, CSPBGA

Quantity 20 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package238-CSBGA (10x10)GradeExtendedOperating Temperature0°C – 100°C
Package / Case238-LFBGA, CSPBGANumber of I/O150Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1825Number of Logic Elements/Cells23360
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1658880

Overview of XC7A25T-L2CPG238E – Artix-7 FPGA, 150 I/Os, 238-LFBGA

The XC7A25T-L2CPG238E is an Artix-7 field programmable gate array (FPGA) in a 238-ball LFBGA/CSPBGA package. It delivers a balance of programmable logic, embedded memory, and I/O capacity for space-conscious designs requiring reconfigurable digital logic.

Built for surface-mount assembly and featuring an extended-grade operating range, this device targets applications where moderate logic density, on-chip memory, and low-voltage core operation are primary considerations.

Key Features

  • Core Architecture Artix-7 FPGA fabric implemented in the XC7A25T-L2CPG238E package.
  • Logic Resources 1,825 CLBs (configurable logic blocks) providing 23,360 logic elements for implementing combinational and sequential logic.
  • Embedded Memory Approximately 1.66 Mbits of on-chip RAM (1,658,880 total bits) to support buffering, FIFOs, and local data storage.
  • I/O Capacity 150 user I/O pins for interfacing to peripherals, sensors, and external devices.
  • Package and Mounting Available in a 238-LFBGA / CSPBGA footprint; supplier device package listed as 238-CSBGA (10×10). Designed for surface-mount assembly.
  • Power Core voltage supply range from 870 mV to 930 mV to match low-voltage system power rails.
  • Thermal and Grade Extended grade device with an operating temperature range of 0 °C to 100 °C.
  • Standards Compliance RoHS compliant.

Unique Advantages

  • Balanced Logic and Memory: The combination of 23,360 logic elements and ~1.66 Mbits of embedded RAM enables compact implementations of custom datapaths and buffering without external memory.
  • Generous I/O Count: 150 user I/Os allow flexible interfacing options for mixed-signal front ends, control buses, and peripheral connectivity while keeping PCB routing manageable.
  • Compact, Industry-Standard Package: The 238-ball LFBGA/CSPBGA (238-CSBGA 10×10) package supports dense board layouts and surface-mount assembly processes.
  • Low-Voltage Core Operation: The 870–930 mV supply range supports integration into low-voltage power domains common in modern systems.
  • Extended Operating Grade: Rated for 0 °C to 100 °C operation, suitable for applications requiring broader commercial temperature tolerance.
  • RoHS Compliant: Meets lead-free and hazardous-substance requirements for environmentally conscious manufacturing.

Why Choose XC7A25T-L2CPG238E?

The XC7A25T-L2CPG238E positions itself as a versatile Artix-7 FPGA option for designs needing a measured combination of logic density, embedded memory, and I/O in a compact surface-mount package. Its low-voltage core, extended temperature grade, and RoHS compliance make it suitable for production designs that balance performance with manufacturability.

This part is appropriate for engineers and procurement teams building systems that require on-chip memory and flexible I/O without moving to larger FPGA families. It delivers scalability through programmable logic and straightforward board-level integration via the 238-ball package.

Request a quote or submit an inquiry to obtain pricing, availability, and delivery details for the XC7A25T-L2CPG238E.

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