XC7A35T-1CPG236I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 106 1843200 33280 238-LFBGA, CSPBGA |
|---|---|
| Quantity | 685 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 238-CSBGA (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 238-LFBGA, CSPBGA | Number of I/O | 106 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2600 | Number of Logic Elements/Cells | 33280 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1843200 |
Overview of XC7A35T-1CPG236I – Artix-7 Field Programmable Gate Array (FPGA)
The XC7A35T-1CPG236I is an Artix-7 FPGA from AMD presented in a 238-LFBGA surface-mount package. It delivers a balanced combination of logic density, on-chip memory and I/O capacity suitable for designs that require reprogrammable digital logic in a compact, industrial-grade device.
Key on-device specifications include 32,280 logic elements, approximately 1.84 Mbits of embedded memory, 106 I/O pins, a core supply range of 0.95–1.05 V and an operating temperature range of -40 °C to 100 °C. The device is offered in a 238-pin LFBGA/CSPBGA footprint (supplier package: 238-CSBGA 10×10) for surface-mount assembly.
Key Features
- Logic Capacity 32,280 logic elements for implementing custom digital logic and finite-state machines.
- Embedded Memory Approximately 1.84 Mbits of on-chip RAM to support buffering, state storage and small data structures without external memory.
- I/O Resources 106 general-purpose I/O pins to connect sensors, peripherals and external logic.
- Power and Core Voltage Core voltage supply range of 0.95 V to 1.05 V to match system power rails and regulator options.
- Package and Mounting 238-LFBGA / CSPBGA package in a surface-mount form factor; supplier device package listed as 238-CSBGA (10×10) for compact board layouts.
- Temperature and Grade Industrial-grade operation across -40 °C to 100 °C for deployment in environments with extended temperature requirements.
Typical Applications
- Custom digital systems — Implement application-specific datapaths and control logic using the available logic elements.
- On-chip buffering and state machines — Leverage approximately 1.84 Mbits of embedded memory for temporary data storage and state retention.
- I/O expansion and interfacing — Use up to 106 I/O pins to interface with sensors, actuators, and peripheral devices in compact designs.
Unique Advantages
- Balanced logic and memory — 32,280 logic elements combined with ~1.84 Mbits of RAM enables both control-oriented and data-path implementations without immediate need for external memory.
- High I/O count in a compact package — 106 I/O pins in a 238-pin LFBGA footprint supports dense connectivity while preserving board area.
- Industrial temperature rating — Specified operation from -40 °C to 100 °C supports deployment in thermally demanding environments.
- Surface-mount package for modern PCB assembly — 238-LFBGA/CSPBGA package suits automated assembly and compact board designs.
- Low-voltage core compatibility — 0.95–1.05 V supply range aligns with common low-voltage regulator domains for efficient power integration.
Why Choose XC7A35T-1CPG236I?
The XC7A35T-1CPG236I delivers a practical mix of logic density, embedded memory and I/O capacity in a compact, surface-mount 238-pin package, and is specified for industrial temperature operation. It is well suited to designers who need a reprogrammable, mid-range FPGA solution that balances on-chip resources with package density.
As an Artix-7 device from AMD, this part provides a clear hardware resource profile—32,280 logic elements, approximately 1.84 Mbits of embedded RAM, 106 I/O—and industrial-grade temperature specifications that support robust, long-lived designs where those concrete capabilities are required.
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