XC7A50T-2CSG324C

The XC7A50T-2CSG324C is an Artix‑7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 324‑LFBGA (15×15) package. It provides a balance of programmable logic, embedded memory, and I/O capacity for designs that require configurable hardware resources in a surface‑mount package.

With 52,160 logic elements and approximately 2.76 Mbits of on‑chip RAM, the device supports applications that need moderate logic density and embedded memory while operating within a commercial temperature range and a core voltage supply of 0.95 V to 1.05 V.

Key Features

• Programmable Logic  Provides 52,160 logic elements to implement custom logic, state machines, and data-paths.
• Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM available for buffering, lookup tables, and small data storage.
• I/O Capacity  210 device I/O pins to support multiple interfaces and external peripherals.
• Power and Supply  Core voltage supply range of 0.95 V to 1.05 V for compatibility with targeted power domains.
• Package and Mounting  324‑LFBGA (324‑CSPBGA, 15×15) package provided for surface‑mount PCB assembly and compact board layouts.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• Embedded Systems  Use the FPGA to implement custom logic functions and data paths where moderate logic density and on‑chip RAM are required.
• Interface & I/O Aggregation  Leverage 210 I/O pins to bridge multiple peripherals and external interfaces in compact systems.
• Prototyping and Development  Employ the device in hardware prototypes that require reprogrammable logic and embedded memory for iterative development.

Unique Advantages

• Balanced Logic Density:  52,160 logic elements provide substantial capacity for complex glue logic and mid‑range FPGA tasks without unnecessary overcapacity.
• On‑Chip Memory:  Approximately 2.76 Mbits of embedded RAM reduce the need for external memory in many buffering and lookup applications.
• High I/O Count:  210 I/O pins enable flexible interfacing options and support for multiple external devices.
• Compact, Surface‑Mount Package:  324‑LFBGA (15×15) package supports dense PCB layouts and standard surface‑mount assembly processes.
• Commercial Temperature Qualification:  Rated 0 °C to 85 °C for designs targeting commercial environments.
• RoHS Compliant:  Meets RoHS requirements for environmentally conscious product designs.

Why Choose XC7A50T-2CSG324C?

The XC7A50T-2CSG324C positions itself as a practical Artix‑7 FPGA option for developers who need a combination of moderate logic capacity, on‑chip memory, and a substantial number of I/O in a compact surface‑mount package. Its specified core voltage range, commercial temperature rating, and RoHS compliance make it suitable for standard embedded and interface‑centric designs.

Choose this part when your design requires reprogrammable logic resources with approximately 2.76 Mbits of embedded memory, up to 210 I/O, and a 324‑LFBGA footprint to simplify board integration and maintain a streamlined bill of materials.

Request a quote or submit an inquiry to receive pricing and availability for the XC7A50T-2CSG324C.