XC7A50T-2CSG324I

The XC7A50T-2CSG324I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides a mid-range programmable-logic fabric with 52,160 logic elements and approximately 2.76 Mbits of on-chip RAM tailored for industrial-grade applications.

With 210 user I/O, a 324-LFBGA package, and an industrial operating temperature range, this device is well suited for designs that require configurable logic density, on-chip memory, and robust thermal performance in surface-mount form factors.

Key Features

• Core Logic 52,160 logic elements organized across 4,075 configurable logic blocks (CLBs) to implement custom digital functions and state machines.
• Embedded Memory Approximately 2.76 Mbits of on-chip RAM for FIFOs, buffers, and state storage.
• Input/Output 210 user I/O pins to interface with peripherals, sensors, and external logic.
• Power Core supply operating range from 0.950 V to 1.05 V for the programmable fabric.
• Package & Mounting 324-LFBGA (324-CSPBGA, 15 × 15 mm) supplier device package in a surface-mount form factor for compact board designs.
• Operating Conditions Industrial-grade temperature rating from −40 °C to 100 °C for extended-environment operation.
• Compliance RoHS compliant.

Typical Applications

• Industrial Automation Deploy custom control logic and I/O aggregation in industrial controllers and motion-control systems taking advantage of the industrial temperature rating and plentiful I/O.
• Embedded Processing Implement hardware-accelerated peripherals, protocol handlers, and glue logic where on-chip RAM and dense logic reduce external component count.
• Communications and Data Paths Build custom packet processing, buffering, and parallel data-handling paths using the device’s logic capacity and embedded memory.

Unique Advantages

• High logic density: 52,160 logic elements provide substantial capacity for complex custom logic while keeping board-level integration compact.
• Significant on-chip memory: Approximately 2.76 Mbits of embedded RAM supports FIFOs and buffering without immediate need for external memory.
• Generous I/O count: 210 user I/O simplifies direct interfacing to multiple peripherals and buses, reducing external glue logic.
• Industrial temperature capability: Rated from −40 °C to 100 °C for reliable operation in challenging environments.
• Compact surface-mount package: 324-LFBGA (15 × 15 mm CSPBGA) enables space-efficient board designs.
• RoHS compliant: Conforms to common environmental standards for regulated markets.

Why Choose XC7A50T-2CSG324I?

The XC7A50T-2CSG324I combines substantial programmable logic capacity with on-chip memory and a high I/O count in a compact 324-LFBGA surface-mount package. Its industrial temperature rating and controlled core voltage range make it suitable for designs that require reliable, configurable logic in challenging environments.

This device is a practical choice for engineers developing industrial automation, embedded processing, and custom data-path applications that need scalable logic resources, embedded RAM, and robust thermal performance from a single FPGA component.

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