XC7A50T-2CSG325I

The XC7A50T-2CSG325I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD presented in a 324-LFBGA (324-CSPBGA 15×15) package. It provides 52,160 logic elements, approximately 2.76 Mbits of embedded RAM, and 150 I/Os in an industrial-grade device specified for operation from -40 °C to 100 °C with a core supply range of 0.950 V to 1.05 V.

Key Features

• Logic Capacity — 52,160 logic elements for implementing moderate-complexity digital designs and custom logic functions.
• Embedded Memory — Approximately 2.76 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage close to logic.
• I/O Count — 150 general-purpose I/Os to interface with peripherals, sensors, and external devices.
• Package — 324-LFBGA (supplier package: 324-CSPBGA, 15×15) surface-mount package for compact board integration.
• Power — Core supply voltage specified from 0.950 V to 1.05 V for predictable power planning.
• Operating Temperature — Industrial temperature range of -40 °C to 100 °C for extended-environment applications.
• RoHS Compliance — Device is RoHS compliant.

Typical Applications

• Industrial Automation — Industrial-grade temperature rating and flexible I/O make this FPGA suitable for control and monitoring systems operating in extended-temperature environments.
• Embedded Systems — On-chip RAM and substantial logic resources enable custom processing, protocol handling, and glue-logic for embedded designs.
• Interface Aggregation — The 150 I/Os support dense interfacing and signal routing between sensors, converters, and system peripherals.

Unique Advantages

• Balanced Logic and Memory — 52,160 logic elements paired with approximately 2.76 Mbits of embedded RAM provide capability for mixed logic and data buffering needs.
• Industrial Temperature Rating — Specified for -40 °C to 100 °C operation to support deployments in harsh or thermally variable environments.
• Compact High-Pin Package — 324-LFBGA (324-CSPBGA 15×15) package offers a high pin count in a compact form factor for space-constrained boards.
• Predictable Power Envelope — Core supply specification of 0.950 V to 1.05 V aids power-supply design and system integration.
• RoHS Compliant — Meets environmental compliance requirements where RoHS status is required.

Why Choose XC7A50T-2CSG325I?

The XC7A50T-2CSG325I delivers a balanced combination of logic density, embedded memory, and I/O capacity in an industrial-grade Artix-7 FPGA package. Its specified operating temperature range and compact 324-LFBGA footprint make it well suited for designs that require reliable operation across extended temperatures and significant interfacing capability.

As an AMD Artix-7 device, it is appropriate for engineers and teams designing industrial control, embedded processing, and interface aggregation solutions that need moderate logic resources with on-chip RAM and a predictable power envelope.

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