XC7A50T-L1FTG256I

The XC7A50T-L1FTG256I is an Artix-7 field programmable gate array (FPGA) IC from AMD, supplied in a 256-ball LBGA package. It delivers a balance of programmable logic resources, on-chip embedded memory and a moderate I/O count for industrial-grade applications.

Designed for surface-mount assembly and rated for industrial temperature operation, this device targets systems that need reprogrammable logic, embedded memory and flexible I/O within a compact package footprint.

Key Features

• Logic Capacity 52,160 logic elements provide the configurable fabric to implement custom digital logic and control functions.
• Embedded Memory Approximately 2.76 Mbits of on-chip RAM supports buffering, state storage and data processing without external memory in many designs.
• I/O Count 170 user I/O pins enable connectivity to sensors, peripherals and external interfaces across a range of system topologies.
• Package and Mounting Supplied in a 256-LBGA (supplier package: 256-FTBGA, 17 × 17) package for compact board integration; mounting type is surface mount.
• Operating Range Industrial-grade temperature rating from −40 °C to 100 °C for deployment in extended-environment applications.
• Core Voltage Core supply range of 0.95 V to 1.05 V for the device core power domain.
• Compliance RoHS compliant to meet common environmental and regulatory requirements for electronic assemblies.

Typical Applications

• Industrial Control — Implement custom control logic, sensor interfacing and deterministic I/O handling using on-chip logic and embedded memory while operating across industrial temperature ranges.
• Embedded Systems — Integrate glue logic, protocol bridging and data buffering in space-constrained boards leveraging the 256-LBGA footprint and surface-mount mounting.
• Communications and Interfaces — Use the 170 I/O pins and programmable logic to implement interface adapters, protocol translators and peripheral controllers.

Unique Advantages

• Balanced Logic and Memory: 52,160 logic elements combined with approximately 2.76 Mbits of embedded RAM enable medium-complexity designs without immediate dependence on external memory.
• Compact, Surface-Mount Package: The 256-LBGA (256-FTBGA, 17 × 17) package supports high-density board layouts while keeping form factor small for embedded applications.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for deployment in environments that require extended temperature operation.
• Moderate I/O Density: 170 I/O pins provide flexibility to connect a variety of peripherals, sensors and interface circuits.
• Low-Voltage Core: 0.95 V to 1.05 V supply range for the core power domain aligns with modern power architectures.
• RoHS Compliant: Meets commonly required environmental compliance for electronic assemblies.

Why Choose XC7A50T-L1FTG256I?

The XC7A50T-L1FTG256I positions itself as an industrial-grade, mid-capacity programmable logic device that combines substantial logic resources, embedded memory and a practical I/O complement in a compact 256-LBGA package. It is suitable for engineering teams building industrial control, embedded and communications subsystems that require reprogrammable logic and robust temperature performance.

Backed by AMD as the manufacturer and offered as a surface-mount, RoHS-compliant device, this FPGA is a candidate for designs that prioritize in-system programmability, board-level integration and the ability to scale logic and memory usage within a single device footprint.

Request a quote or submit an inquiry to get pricing and availability for the XC7A50T-L1FTG256I and to discuss how it fits your next design.