XC7A50T-L2CSG324E

The XC7A50T-L2CSG324E is an Artix-7 field programmable gate array (FPGA) from AMD, supplied in a 324-ball CSPBGA (324-LFBGA) package. It provides 52,160 logic elements and approximately 2.76 Mbits of on-chip RAM, along with 210 general-purpose I/O signals and an extended device grade for designs that require a defined commercial temperature range.

Designed for surface-mount integration, this device operates from a core voltage range of 0.95 V to 1.05 V and is specified for operation between 0 °C and 100 °C, making it suitable for mid-range embedded and I/O‑rich applications that need substantial logic and memory resources in a compact package.

Key Features

• Core Logic 52,160 logic elements to implement custom digital logic and control functions.
• Embedded Memory Approximately 2.76 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Resources Up to 210 user I/O pins for interfacing to peripherals, sensors, and external devices.
• Power Core supply voltage specified between 0.95 V and 1.05 V to match system power-rail requirements.
• Package & Mounting 324-ball CSPBGA (324-LFBGA) 15 × 15 mm supplier package, intended for surface-mount PCB assembly.
• Operating Range & Grade Rated for operation from 0 °C to 100 °C and listed as Extended grade.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Embedded Systems — Provides programmable logic and on-chip memory for custom control, protocol handling, and peripheral aggregation in compact embedded designs.
• Signal Processing — Use the combination of logic elements and embedded RAM for buffering, data formatting, and real-time processing pipelines.
• Interface Concentration — High I/O count enables aggregation and translation of multiple digital interfaces in gateway and bridge functions.
• Rapid Prototyping — Sufficient logic and memory resources for validating hardware architectures and accelerating development cycles.

Unique Advantages

• Substantial Logic Capacity: 52,160 logic elements allow implementation of complex state machines, datapaths, and control logic without external ASICs.
• On‑Chip Memory: Approximately 2.76 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O Count: 210 I/O pins enable flexible interfacing to multiple subsystems while keeping the bill of materials compact.
• Compact BGA Packaging: 324-LFBGA (324-CSPBGA) in a 15 × 15 mm supplier package provides a space-efficient footprint for PCB-constrained designs.
• Defined Voltage and Temperature Specs: Clear core voltage range (0.95–1.05 V) and operating temperature (0–100 °C) simplify power and thermal planning.
• RoHS Compliant: Supports lead-free assembly and materials compliance requirements.

Why Choose XC7A50T-L2CSG324E?

The XC7A50T-L2CSG324E combines a mid-to-high density logic fabric with substantial on-chip memory and a high I/O count in a compact 324-ball CSPBGA package. Its specified voltage range and 0 °C to 100 °C operating window make it a practical choice for designers needing significant programmable resources while maintaining straightforward power and thermal requirements.

This device is well suited to engineers developing embedded systems, interface concentrators, signal processing blocks, and prototype platforms that require integrated logic, memory, and I/O in a surface-mount BGA form factor. Its RoHS compliance and Extended grade provide clear, verifiable parameters for procurement and design integration.

Request a quote for XC7A50T-L2CSG324E or submit a procurement inquiry to receive pricing and availability tailored to your build quantities and delivery needs.