XC7A50T-L2CSG325E

The XC7A50T-L2CSG325E is an Artix-7 Field Programmable Gate Array (FPGA) IC providing a balance of programmable logic, embedded memory, and I/O capacity in a compact surface-mount package. It delivers 52,160 logic elements, approximately 2.76 Mbits of on-chip RAM, and 150 user I/Os, making it suitable for designs that require substantial logic resources and moderate embedded memory.

Designed for extended-grade operation, the device operates from a core supply range of 950 mV to 1.05 V and supports an ambient temperature range of 0 °C to 100 °C. The part is offered in a 324-ball CSPBGA/LFBGA package for space-efficient board integration and is RoHS compliant.

Key Features

• Programmable Logic Capacity  Provides 52,160 logic elements to implement custom digital logic and control functions.
• Embedded Memory  Approximately 2.76 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Count  150 user I/Os for interfacing with external devices, peripherals, and board-level buses.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match platform power architecture requirements.
• Package and Mounting  Available in a 324-LFBGA / 324-CSPBGA (15×15) footprint with surface-mount mounting for compact PCB layouts.
• Temperature and Grade  Extended-grade device rated for operation from 0 °C to 100 °C for a range of temperature environments.
• Regulatory  RoHS compliant construction for lead-free assembly and environmental compliance.

Typical Applications

• Custom digital logic  Implement user-defined state machines, datapath logic, and control algorithms using the device’s 52,160 logic elements.
• I/O interface bridging  Use the 150 I/Os to connect and translate between multiple board-level interfaces or peripheral devices.
• On-chip buffering and storage  Leverage approximately 2.76 Mbits of embedded RAM for temporary data storage, FIFOs, and small lookup tables.

Unique Advantages

• High logic density: 52,160 logic elements enable substantial custom logic integration without external silicon.
• Moderate embedded memory: Approximately 2.76 Mbits of on-chip RAM reduces dependency on external memory for many control and buffering tasks.
• Generous I/O count: 150 user I/Os provide flexibility for multi-device interfaces and mixed-signal board designs.
• Compact surface-mount package: 324-CSPBGA (15×15) / 324-LFBGA packaging simplifies PCB routing while conserving board area.
• Extended-grade temperature: Rated 0 °C to 100 °C to support a range of ambient operating conditions.
• Regulatory compliance: RoHS compliant for lead-free manufacturing workflows.

Why Choose XC7A50T-L2CSG325E?

The XC7A50T-L2CSG325E positions itself as a versatile FPGA option where a balance of logic capacity, embedded memory, and I/O density is required in a compact, surface-mount form factor. Its specified core voltage range and extended operating temperature make it suitable for designs that need controlled power integration and stable performance across typical ambient conditions.

Engineers and procurement teams looking to consolidate functionality onto a single programmable device will find the XC7A50T-L2CSG325E offers clear, verifiable resource counts—52,160 logic elements, approximately 2.76 Mbits of RAM, 150 I/Os—packed into a 324-ball CSPBGA/LFBGA package with RoHS compliance for lead-free assembly.

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