XC7A75T-1CS324I

The XC7A75T-1CS324I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 324‑LFBGA (324‑CSPBGA, 15×15) surface-mount package. It provides substantial programmable logic capacity and on-chip memory combined with a broad operating temperature range for industrial applications.

With 75,520 logic elements, approximately 3.87 Mbits of embedded memory and 210 I/O, this device targets designs that require considerable integration of programmable logic, memory and I/O in a compact package while operating at low core voltages.

Key Features

• Logic Capacity  75,520 logic elements to implement complex digital logic and custom accelerators.
• On‑chip Memory  Approximately 3.87 Mbits of embedded RAM for buffering, state storage and local data processing.
• I/O Density  210 user I/O pins to connect to peripherals, sensors and external interfaces.
• Power  Core supply voltage range of 0.95 V to 1.05 V for low-voltage FPGA core operation.
• Package and Mounting  324‑LFBGA (324‑CSPBGA, 15×15) surface-mount package for compact board-level integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• RoHS Compliant  Meets RoHS environmental compliance requirements.

Unique Advantages

• High logic density: 75,520 logic elements enable implementation of sizeable custom digital functions without external ASICs.
• Substantial embedded memory: Approximately 3.87 Mbits of on‑chip RAM reduce external memory requirements for many designs.
• Generous I/O count: 210 I/O pins support multiple parallel interfaces and board-level connectivity.
• Industrial temperature capability: −40 °C to 100 °C rating for deployment in demanding environments.
• Compact surface-mount package: 324‑LFBGA (15×15 CSPBGA) balances board space and thermal characteristics for dense designs.
• Low core voltage operation: 0.95 V–1.05 V supply range supports modern low-voltage system architectures.

Why Choose XC7A75T-1CS324I?

The XC7A75T-1CS324I combines high logic element count, significant on‑chip RAM and a large number of I/Os in a compact 324‑LFBGA surface-mount package, making it suitable for industrial designs that require integrated programmable logic and memory at low core voltages. Its −40 °C to 100 °C operating range and RoHS compliance further support deployment in industrial environments.

Selected for projects that need a balance of capacity, I/O and compact packaging, this Artix‑7 FPGA is positioned for engineering teams looking to consolidate functions into a programmable device while maintaining industrial temperature performance and supply-chain compatibility with AMD components.

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