XC7A75T-1FGG484C
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 285 3870720 75520 484-BBGA |
|---|---|
| Quantity | 263 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5900 | Number of Logic Elements/Cells | 75520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3870720 |
Overview of XC7A75T-1FGG484C – Artix-7 Field Programmable Gate Array (FPGA) 484‑BBGA
The XC7A75T-1FGG484C is an Artix‑7 family Field Programmable Gate Array from AMD, offering a balanced combination of logic capacity, on‑chip memory and I/O density in a compact BGA package. Designed for commercial applications, the device provides a programmable fabric suited to custom digital logic, data buffering and multi‑interface board designs.
Key hardware characteristics include 75,520 logic elements, approximately 3.87 Mbits of embedded RAM, 285 I/O pins, a 484‑BBGA / 484‑FBGA (23×23) package, a core supply range of 950 mV to 1.05 V, and a commercial operating temperature range of 0 °C to 85 °C.
Key Features
- Core Logic — 75,520 logic elements provide substantial programmable fabric for implementing custom pipelines, state machines and control logic.
- Embedded Memory — Approximately 3.87 Mbits of on‑chip RAM enables local buffering, lookup tables and small data stores without requiring external memory.
- I/O Density — 285 general‑purpose I/O pins support high‑pin‑count interfaces and multiple peripheral connections on a single device.
- Power Supply — Core voltage range of 950 mV to 1.05 V to match the device's specified supply requirements.
- Package — 484‑BBGA package case with supplier device package listed as 484‑FBGA (23×23), suitable for dense PCB layouts.
- Mounting — Surface mount device intended for standard PCB assembly processes.
- Temperature Range — Commercial operating range from 0 °C to 85 °C for standard commercial deployments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High‑density I/O systems — Use the 285 I/O pins to implement multi‑interface bridging, peripheral aggregation or board‑level control functions.
- Embedded memory‑centric designs — Leverage approximately 3.87 Mbits of on‑chip RAM for buffering, packet memory or state storage without immediate need for external RAM.
- Custom digital logic and processing — Deploy the 75,520 logic elements to implement application‑specific processing pipelines, protocol handlers and control logic on a single FPGA.
Unique Advantages
- High logic capacity: 75,520 logic elements enable significant integration of custom logic and reduce the need for multiple devices.
- On‑chip memory availability: Approximately 3.87 Mbits of embedded RAM provides on‑device storage for buffering and LUTs, simplifying board-level memory requirements.
- Generous I/O count: 285 I/Os support complex interfacing and high connector pin counts without multiplexing external logic.
- Compact, manufacturable package: 484‑BBGA / 484‑FBGA (23×23) supports high‑density PCB layouts and standard surface‑mount assembly.
- Commercial grade operation: Rated for 0 °C to 85 °C to meet typical commercial application conditions.
- RoHS compliant: Meets lead‑free environmental requirements for commercial products.
Why Choose XC7A75T-1FGG484C?
The XC7A75T-1FGG484C positions itself as a capable, commercial‑grade Artix‑7 FPGA that balances logic density, on‑chip memory and I/O resources in a single surface‑mount package. Its specifications make it well suited for design teams needing substantial programmable fabric and embedded RAM within a compact 484‑BGA footprint.
For projects that require consolidated digital logic, board‑level interfacing and reduced external component count, this device offers a scalable foundation that aligns with standard commercial operating conditions and manufacturing processes.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7A75T-1FGG484C.

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