XC7A75T-1FGG676C

IC FPGA 300 I/O 676FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 300 3870720 75520 676-BGA

Quantity 631 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O300Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-1FGG676C – Artix-7 Field Programmable Gate Array (FPGA)

The XC7A75T-1FGG676C is an Artix-7 field programmable gate array in a 676-ball BGA package from AMD. It provides a balance of logic capacity, embedded memory, and I/O count for commercial-grade system designs requiring mid-range programmable logic integration. Key value comes from its combination of approximately 75,520 logic elements, roughly 3.87 Mbits of on-chip RAM, and 300 user I/O pins in a compact 676-FBGA (27×27) package.

Key Features

  • Core Logic  Approximately 75,520 logic elements for implementing complex custom digital functions.
  • Embedded Memory  Approximately 3.87 Mbits of on-chip RAM to support buffering, FIFOs, and distributed storage.
  • I/O Capacity  300 user I/O pins to interface with external peripherals, sensors, and high-speed buses.
  • Package & Mounting  676-FBGA (27×27) package, 676-BGA case, designed for surface-mount PCB assembly.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V for device operation.
  • Operating Range  Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Custom digital logic and prototyping  Deploy where approximately 75,520 logic elements and 300 I/O are required to implement tailored logic blocks or to prototype system behavior.
  • Embedded memory–intensive functions  Use the device’s ~3.87 Mbits of on-chip RAM for buffering, packet storage, or intermediate data processing within custom logic.
  • I/O-dense interfacing  Integrate into designs that need a high count of user I/O signals in a compact BGA footprint.

Unique Advantages

  • Significant logic capacity: Approximately 75,520 logic elements enable complex finite-state machines, data path logic, and custom accelerators.
  • Substantial on-chip RAM: Approximately 3.87 Mbits of embedded memory reduces external memory dependency for many buffering and storage needs.
  • High I/O count in a compact package: 300 I/O pins in a 676-FBGA (27×27) package allow dense system integration while maintaining a small PCB footprint.
  • Commercial-grade operation: Rated for 0 °C to 85 °C, suitable for standard commercial applications.
  • RoHS compliant: Meets common environmental compliance expectations for commercial electronics.
  • Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports low-voltage system architectures.

Why Choose XC7A75T-1FGG676C?

The XC7A75T-1FGG676C positions itself as a versatile mid-range FPGA option for designers who need a meaningful balance of logic resources, embedded memory, and I/O in a compact surface-mount BGA package. Its combination of approximately 75,520 logic elements, ~3.87 Mbits of on-chip RAM, and 300 user I/Os makes it well suited to custom digital implementations where integration density and on-chip memory are important factors.

For commercial product designs and development platforms that require a reliable, RoHS-compliant programmable logic device with defined operating and supply ranges, this Artix-7 device provides capacity and packaging that support scalable design choices and long-term maintainability.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7A75T-1FGG676C for your next design.

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